METHOD OF MANUFACTURING A SEMICONDUCTOR BODY COMPRISING A CARRIER WAFER AND A MONOCRYSTALLINE SEMICONDUCTING TOP LAYER

A method of manufacturing a semiconductor body (1), whereby a carrier wafer (2) with an optically smooth main surface (3) is provided with a semiconducting top layer (4) in that the main surface (3) is brought into contact with an optically smooth main surface (5) of a monocrystalline semiconductor...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	VAN DER KRUIS, FRANCISCUS JOSEPHUS HENRI MARIA, HAISMA, JAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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