Substrate to heatsink interface apparatus and method

Substrate to heatsink interface apparatus and method

A cooling apparatus for a substrate (10) with heat generating circuit devices (20) mounted on a first side (11) thereof. A second side (12) of the substrate is coated with a first layer made of a releasing agent (50). A second layer (60) made of a thermally conductive material having a low melting p...

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1. Verfasser: SAMAROV, VICTOR M
Format: Patent
Sprache:eng ; fre ; ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SAMAROV, VICTOR M
description A cooling apparatus for a substrate (10) with heat generating circuit devices (20) mounted on a first side (11) thereof. A second side (12) of the substrate is coated with a first layer made of a releasing agent (50). A second layer (60) made of a thermally conductive material having a low melting point is provided on the first layer. A heat sink (30) is provided on the second layer, for radiating heat transmitted from the circuit device through the substrate, the first layer and the second layer. During the assembly, the apparatus is heated and compressed to reflow the second layer reducing any air pocket formed at the substrate-to-heatsink interface.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Substrate to heatsink interface apparatus and method
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