Solid state image pick-up device

A solid image pick-up element comprises a semiconductor substrate (11), a photoelectric transfer region formed on the substrate (11), and an optical black region formed on the substrate (11). Each of the photoelectric transfer region and the optical black region includes a plurality of regularly arr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: IMANAKA, YASUHIRO, NAKAI, JUNICHI, ISHIBE, SHOUICHI, AOKI, TETSURO
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator IMANAKA, YASUHIRO
NAKAI, JUNICHI
ISHIBE, SHOUICHI
AOKI, TETSURO
description A solid image pick-up element comprises a semiconductor substrate (11), a photoelectric transfer region formed on the substrate (11), and an optical black region formed on the substrate (11). Each of the photoelectric transfer region and the optical black region includes a plurality of regularly arrayed light receiving units. A shielding film (18) is formed on the light receiving units of the optical black region and is covered with a shielding layer (21). Preferably, the shielding film comprises three color filters (21a, 21b, 21c) in red, green and blue. Even if the shielding film causes light leakage, the shielding layer makes light damp, thereby reducing the occurrence of light leakage.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP0518686A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP0518686A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP0518686A13</originalsourceid><addsrcrecordid>eNrjZFAIzs_JTFEoLkksSVXIzE1MT1UoyEzO1i0tUEhJLctMTuVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAQamhhZmFmaOhsZEKAEA4cIkew</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Solid state image pick-up device</title><source>esp@cenet</source><creator>IMANAKA, YASUHIRO ; NAKAI, JUNICHI ; ISHIBE, SHOUICHI ; AOKI, TETSURO</creator><creatorcontrib>IMANAKA, YASUHIRO ; NAKAI, JUNICHI ; ISHIBE, SHOUICHI ; AOKI, TETSURO</creatorcontrib><description>A solid image pick-up element comprises a semiconductor substrate (11), a photoelectric transfer region formed on the substrate (11), and an optical black region formed on the substrate (11). Each of the photoelectric transfer region and the optical black region includes a plurality of regularly arrayed light receiving units. A shielding film (18) is formed on the light receiving units of the optical black region and is covered with a shielding layer (21). Preferably, the shielding film comprises three color filters (21a, 21b, 21c) in red, green and blue. Even if the shielding film causes light leakage, the shielding layer makes light damp, thereby reducing the occurrence of light leakage.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19921216&amp;DB=EPODOC&amp;CC=EP&amp;NR=0518686A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19921216&amp;DB=EPODOC&amp;CC=EP&amp;NR=0518686A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IMANAKA, YASUHIRO</creatorcontrib><creatorcontrib>NAKAI, JUNICHI</creatorcontrib><creatorcontrib>ISHIBE, SHOUICHI</creatorcontrib><creatorcontrib>AOKI, TETSURO</creatorcontrib><title>Solid state image pick-up device</title><description>A solid image pick-up element comprises a semiconductor substrate (11), a photoelectric transfer region formed on the substrate (11), and an optical black region formed on the substrate (11). Each of the photoelectric transfer region and the optical black region includes a plurality of regularly arrayed light receiving units. A shielding film (18) is formed on the light receiving units of the optical black region and is covered with a shielding layer (21). Preferably, the shielding film comprises three color filters (21a, 21b, 21c) in red, green and blue. Even if the shielding film causes light leakage, the shielding layer makes light damp, thereby reducing the occurrence of light leakage.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAIzs_JTFEoLkksSVXIzE1MT1UoyEzO1i0tUEhJLctMTuVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAQamhhZmFmaOhsZEKAEA4cIkew</recordid><startdate>19921216</startdate><enddate>19921216</enddate><creator>IMANAKA, YASUHIRO</creator><creator>NAKAI, JUNICHI</creator><creator>ISHIBE, SHOUICHI</creator><creator>AOKI, TETSURO</creator><scope>EVB</scope></search><sort><creationdate>19921216</creationdate><title>Solid state image pick-up device</title><author>IMANAKA, YASUHIRO ; NAKAI, JUNICHI ; ISHIBE, SHOUICHI ; AOKI, TETSURO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0518686A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1992</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>IMANAKA, YASUHIRO</creatorcontrib><creatorcontrib>NAKAI, JUNICHI</creatorcontrib><creatorcontrib>ISHIBE, SHOUICHI</creatorcontrib><creatorcontrib>AOKI, TETSURO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IMANAKA, YASUHIRO</au><au>NAKAI, JUNICHI</au><au>ISHIBE, SHOUICHI</au><au>AOKI, TETSURO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Solid state image pick-up device</title><date>1992-12-16</date><risdate>1992</risdate><abstract>A solid image pick-up element comprises a semiconductor substrate (11), a photoelectric transfer region formed on the substrate (11), and an optical black region formed on the substrate (11). Each of the photoelectric transfer region and the optical black region includes a plurality of regularly arrayed light receiving units. A shielding film (18) is formed on the light receiving units of the optical black region and is covered with a shielding layer (21). Preferably, the shielding film comprises three color filters (21a, 21b, 21c) in red, green and blue. Even if the shielding film causes light leakage, the shielding layer makes light damp, thereby reducing the occurrence of light leakage.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP0518686A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Solid state image pick-up device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T16%3A57%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=IMANAKA,%20YASUHIRO&rft.date=1992-12-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP0518686A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true