Miniature electronic device aligner using capacitance techniques

A method and structure permit the precision alignment in the packaging of optical components (10), such as lasers, detectors, lenses and waveguides. The technique involves capacitance measurements of an array of plates placed on the optoelectronic device chip and its package substrate (12). The tech...

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Hauptverfasser: FLINT, EPHRAIM BEMIS, YARMCHUK, EDWARD JOHN
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Sprache:eng ; fre ; ger
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creator FLINT, EPHRAIM BEMIS
YARMCHUK, EDWARD JOHN
description A method and structure permit the precision alignment in the packaging of optical components (10), such as lasers, detectors, lenses and waveguides. The technique involves capacitance measurements of an array of plates placed on the optoelectronic device chip and its package substrate (12). The technique uses phase sensitive detection to sense the total current capacitively coupled into a passive plate (14) on the device chip (10) from two overlapping plates (16, 18) located on the package substrate. When the device chip (10) is properly aligned with respect to the package substrate (12), the summed current sensed with a third overlapping plate (22) on the package substrate is a null.
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language eng ; fre ; ger
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title Miniature electronic device aligner using capacitance techniques
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