Method of and apparatus for producing a strip of lead frames for integrated circuit dies in a continuous system
Lead frames for microchips and other integrated circuit dies are produced by a continuous manufacturing method and apparatus in which silver spot plating is done prior to etching away unwanted portions of the lead frame substrate. A flexible substrate of a metal alloy is fed continuously from a reel...
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| description | Lead frames for microchips and other integrated circuit dies are produced by a continuous manufacturing method and apparatus in which silver spot plating is done prior to etching away unwanted portions of the lead frame substrate. A flexible substrate of a metal alloy is fed continuously from a reel, then spot plated with silver, coated with a photosensitive material, and exposed to intensive light in an exposure chamber using a photoresist or masking tool of predetermined design. The exposed photosensitive material is developed chemically, etched in acid, and placed in a chemical solution to remove any remaining unwanted material. The strip is then dried, cut to predetermined lengths and boxed for shipment. If necessary, the strip is downset and taped before packaging. In a presently preferred process, the metal alloy substrate is 42 alloy (Fe + Ni), and the selective spot plating is silver 100 to 150 microinches (2.5 to 3.8 mucrons) thick. The silver does not dissolve in the etchants and therefore has to be removed from exposed areas, preferably by "reverse" plating techniques. |
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A flexible substrate of a metal alloy is fed continuously from a reel, then spot plated with silver, coated with a photosensitive material, and exposed to intensive light in an exposure chamber using a photoresist or masking tool of predetermined design. The exposed photosensitive material is developed chemically, etched in acid, and placed in a chemical solution to remove any remaining unwanted material. The strip is then dried, cut to predetermined lengths and boxed for shipment. If necessary, the strip is downset and taped before packaging. In a presently preferred process, the metal alloy substrate is 42 alloy (Fe + Ni), and the selective spot plating is silver 100 to 150 microinches (2.5 to 3.8 mucrons) thick. The silver does not dissolve in the etchants and therefore has to be removed from exposed areas, preferably by "reverse" plating techniques.</description><language>eng ; fre ; ger</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CINEMATOGRAPHY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MATERIALS THEREFOR ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920701&DB=EPODOC&CC=EP&NR=0492952A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920701&DB=EPODOC&CC=EP&NR=0492952A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JOHNSON, FRANK J</creatorcontrib><title>Method of and apparatus for producing a strip of lead frames for integrated circuit dies in a continuous system</title><description>Lead frames for microchips and other integrated circuit dies are produced by a continuous manufacturing method and apparatus in which silver spot plating is done prior to etching away unwanted portions of the lead frame substrate. A flexible substrate of a metal alloy is fed continuously from a reel, then spot plated with silver, coated with a photosensitive material, and exposed to intensive light in an exposure chamber using a photoresist or masking tool of predetermined design. The exposed photosensitive material is developed chemically, etched in acid, and placed in a chemical solution to remove any remaining unwanted material. The strip is then dried, cut to predetermined lengths and boxed for shipment. If necessary, the strip is downset and taped before packaging. In a presently preferred process, the metal alloy substrate is 42 alloy (Fe + Ni), and the selective spot plating is silver 100 to 150 microinches (2.5 to 3.8 mucrons) thick. The silver does not dissolve in the etchants and therefore has to be removed from exposed areas, preferably by "reverse" plating techniques.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDEOwjAMRbswIOAOvgASFBg6IlTEgsTAjqzEKZZaO0qcgdsTBAdg-sN7788bvZI91YMGQPGAMWJCKxmCJohJfXEsAyBkSxw_2kjoISSc6CuxGA21IQ-Okyts4Lkyllo5FWMpWg_zKxtNy2YWcMy0-u2igXN_P13WFPVBOaIjIXv0t82-a7tDe9zu_lDeO8VCPg</recordid><startdate>19920701</startdate><enddate>19920701</enddate><creator>JOHNSON, FRANK J</creator><scope>EVB</scope></search><sort><creationdate>19920701</creationdate><title>Method of and apparatus for producing a strip of lead frames for integrated circuit dies in a continuous system</title><author>JOHNSON, FRANK J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0492952A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1992</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JOHNSON, FRANK J</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JOHNSON, FRANK J</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of and apparatus for producing a strip of lead frames for integrated circuit dies in a continuous system</title><date>1992-07-01</date><risdate>1992</risdate><abstract>Lead frames for microchips and other integrated circuit dies are produced by a continuous manufacturing method and apparatus in which silver spot plating is done prior to etching away unwanted portions of the lead frame substrate. A flexible substrate of a metal alloy is fed continuously from a reel, then spot plated with silver, coated with a photosensitive material, and exposed to intensive light in an exposure chamber using a photoresist or masking tool of predetermined design. The exposed photosensitive material is developed chemically, etched in acid, and placed in a chemical solution to remove any remaining unwanted material. The strip is then dried, cut to predetermined lengths and boxed for shipment. If necessary, the strip is downset and taped before packaging. In a presently preferred process, the metal alloy substrate is 42 alloy (Fe + Ni), and the selective spot plating is silver 100 to 150 microinches (2.5 to 3.8 mucrons) thick. The silver does not dissolve in the etchants and therefore has to be removed from exposed areas, preferably by "reverse" plating techniques.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS THEREFOR METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | Method of and apparatus for producing a strip of lead frames for integrated circuit dies in a continuous system |
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