HEAT SINK AND THE PRODUCING METHOD THEREOF
A heat sink (11) according to the invention comprises a multilayered body (14) prepared by laying one upon the other a plurality of heat sink fin elements (12) having pin-fin sections (17) formed by cutting a number of slits (16) through thin plates (15) of a thermally conductive material with space...
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| creator | KAWANO, KOICHIRO HISANO, KATSUMI TERASHIMA, TOSHINORI SASAKI, TOMIYA MINAKAMI, KO MAEDA, TOSHIO IWASAKI, HIDEO |
| description | A heat sink (11) according to the invention comprises a multilayered body (14) prepared by laying one upon the other a plurality of heat sink fin elements (12) having pin-fin sections (17) formed by cutting a number of slits (16) through thin plates (15) of a thermally conductive material with spacers (13), each being inserted between two adjacent heat sink fin elements to separate them by a given distance. The method of preparing a heat sink (11) comprises steps of preparing heat sink fin elements by forming a number of slits and a surrounding marginal frame area in each of a first set of thermally conductive thin plates, preparing spacers by cutting out a central area of and forming a surrounding marginal frame area in each of a second set of thermally conductive thin plates having a shape same as that of the first set of thin plates, laying said heat sink fin elements and said spacers alternately one upon the other and bonding said assembled heat sink fin elements and spacers together at the outer surface or contacted areas to form a multilayered body. |
| format | Patent |
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The method of preparing a heat sink (11) comprises steps of preparing heat sink fin elements by forming a number of slits and a surrounding marginal frame area in each of a first set of thermally conductive thin plates, preparing spacers by cutting out a central area of and forming a surrounding marginal frame area in each of a second set of thermally conductive thin plates having a shape same as that of the first set of thin plates, laying said heat sink fin elements and said spacers alternately one upon the other and bonding said assembled heat sink fin elements and spacers together at the outer surface or contacted areas to form a multilayered body.</description><edition>5</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930317&DB=EPODOC&CC=EP&NR=0485205A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930317&DB=EPODOC&CC=EP&NR=0485205A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWANO, KOICHIRO</creatorcontrib><creatorcontrib>HISANO, KATSUMI</creatorcontrib><creatorcontrib>TERASHIMA, TOSHINORI</creatorcontrib><creatorcontrib>SASAKI, TOMIYA</creatorcontrib><creatorcontrib>MINAKAMI, KO</creatorcontrib><creatorcontrib>MAEDA, TOSHIO</creatorcontrib><creatorcontrib>IWASAKI, HIDEO</creatorcontrib><title>HEAT SINK AND THE PRODUCING METHOD THEREOF</title><description>A heat sink (11) according to the invention comprises a multilayered body (14) prepared by laying one upon the other a plurality of heat sink fin elements (12) having pin-fin sections (17) formed by cutting a number of slits (16) through thin plates (15) of a thermally conductive material with spacers (13), each being inserted between two adjacent heat sink fin elements to separate them by a given distance. The method of preparing a heat sink (11) comprises steps of preparing heat sink fin elements by forming a number of slits and a surrounding marginal frame area in each of a first set of thermally conductive thin plates, preparing spacers by cutting out a central area of and forming a surrounding marginal frame area in each of a second set of thermally conductive thin plates having a shape same as that of the first set of thin plates, laying said heat sink fin elements and said spacers alternately one upon the other and bonding said assembled heat sink fin elements and spacers together at the outer surface or contacted areas to form a multilayered body.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDycHUMUQj29PNWcPRzUQjxcFUICPJ3CXX29HNX8HUN8fAHCwa5-rvxMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ41wADEwtTIwNTR2NjIpQAAOc4I_E</recordid><startdate>19930317</startdate><enddate>19930317</enddate><creator>KAWANO, KOICHIRO</creator><creator>HISANO, KATSUMI</creator><creator>TERASHIMA, TOSHINORI</creator><creator>SASAKI, TOMIYA</creator><creator>MINAKAMI, KO</creator><creator>MAEDA, TOSHIO</creator><creator>IWASAKI, HIDEO</creator><scope>EVB</scope></search><sort><creationdate>19930317</creationdate><title>HEAT SINK AND THE PRODUCING METHOD THEREOF</title><author>KAWANO, KOICHIRO ; HISANO, KATSUMI ; TERASHIMA, TOSHINORI ; SASAKI, TOMIYA ; MINAKAMI, KO ; MAEDA, TOSHIO ; IWASAKI, HIDEO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0485205A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>KAWANO, KOICHIRO</creatorcontrib><creatorcontrib>HISANO, KATSUMI</creatorcontrib><creatorcontrib>TERASHIMA, TOSHINORI</creatorcontrib><creatorcontrib>SASAKI, TOMIYA</creatorcontrib><creatorcontrib>MINAKAMI, KO</creatorcontrib><creatorcontrib>MAEDA, TOSHIO</creatorcontrib><creatorcontrib>IWASAKI, HIDEO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAWANO, KOICHIRO</au><au>HISANO, KATSUMI</au><au>TERASHIMA, TOSHINORI</au><au>SASAKI, TOMIYA</au><au>MINAKAMI, KO</au><au>MAEDA, TOSHIO</au><au>IWASAKI, HIDEO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT SINK AND THE PRODUCING METHOD THEREOF</title><date>1993-03-17</date><risdate>1993</risdate><abstract>A heat sink (11) according to the invention comprises a multilayered body (14) prepared by laying one upon the other a plurality of heat sink fin elements (12) having pin-fin sections (17) formed by cutting a number of slits (16) through thin plates (15) of a thermally conductive material with spacers (13), each being inserted between two adjacent heat sink fin elements to separate them by a given distance. The method of preparing a heat sink (11) comprises steps of preparing heat sink fin elements by forming a number of slits and a surrounding marginal frame area in each of a first set of thermally conductive thin plates, preparing spacers by cutting out a central area of and forming a surrounding marginal frame area in each of a second set of thermally conductive thin plates having a shape same as that of the first set of thin plates, laying said heat sink fin elements and said spacers alternately one upon the other and bonding said assembled heat sink fin elements and spacers together at the outer surface or contacted areas to form a multilayered body.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS |
| title | HEAT SINK AND THE PRODUCING METHOD THEREOF |
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