Enhanced multichip module cooling with thermal optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same

Enhanced multichip module cooling with thermal optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same

A thermally optimized piston (200) for use in a liquid cooled module. The thermally optimized piston has three distinctive sections, an upper tapered section (202), a central cylindrical section (204), and a lower diverging section (206). In a preferred embodiment, the thermally optimized piston is...

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Hauptverfasser: ZUMBRUNNEN, MICHAEL LYNN, ELLSWORTH, MICHAEL JOSEPH, JR, GOTH, GARY FRANKLIN, SIMONS, ROBERT EDWARD, CHU, RICHARD CHAO-FAN
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ZUMBRUNNEN, MICHAEL LYNN
ELLSWORTH, MICHAEL JOSEPH, JR
GOTH, GARY FRANKLIN
SIMONS, ROBERT EDWARD
CHU, RICHARD CHAO-FAN
description A thermally optimized piston (200) for use in a liquid cooled module. The thermally optimized piston has three distinctive sections, an upper tapered section (202), a central cylindrical section (204), and a lower diverging section (206). In a preferred embodiment, the thermally optimized piston is provided as part of an improved electronic module. The improved electronic module includes enhanced convective cooling channels disposed between the pistons.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Enhanced multichip module cooling with thermal optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
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