HEAT DISSIPATION METHOD AND PACKAGE FOR POWER SEMICONDUCTOR COMPONENTS

A heat dissipating module and package for power microwave transistors and method of making same that includes a substrate having a thick copper layer bonded to a ceramic core which is thereto subjected to high processing temperatures.

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Hauptverfasser:	PETROSKY, KENNETH JOSEPH, RAIOUDHURY, PROSENJIT, PAPANIA, RICHARD REGIS, BUHAY, HARRY, MADIA, GENE ANTHONY, COSTELLO, JOHN ANDREW
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	PETROSKY, KENNETH JOSEPH RAIOUDHURY, PROSENJIT PAPANIA, RICHARD REGIS BUHAY, HARRY MADIA, GENE ANTHONY COSTELLO, JOHN ANDREW
description	A heat dissipating module and package for power microwave transistors and method of making same that includes a substrate having a thick copper layer bonded to a ceramic core which is thereto subjected to high processing temperatures.
format	Patent
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	HEAT DISSIPATION METHOD AND PACKAGE FOR POWER SEMICONDUCTOR COMPONENTS
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