EPOXY RESIN-IMPREGNATED GLASS CLOTH SHEET HAVING ADHESIVE LAYER
An epoxy resin-impregnated glass cloth sheet having an adhesive layer provided on at least one side of the surface thereof, characterized in that (A) said epoxy resin-impregnated glass cloth sheet is formed by impregnating glass cloth with a curable epoxy resin composition and curing it, said curabl...
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| creator | HORIBA, YASUHIRO KOHMURA, TOSHIMI NEMOTO, YOUSUI ITOH, AKIYOSHI |
| description | An epoxy resin-impregnated glass cloth sheet having an adhesive layer provided on at least one side of the surface thereof, characterized in that (A) said epoxy resin-impregnated glass cloth sheet is formed by impregnating glass cloth with a curable epoxy resin composition and curing it, said curable epoxy resin composition comprising an epoxy resin represented by the following structural formula (I), a brominated epoxy resin and a curing agent for epoxy resin in such an amount that the content of the epoxy resin represented by the following structural formula (I) is 5 to 50% by weight based on the amount of the entire epoxy resins and the content of bromine atom is 14 to 30% by weight based on the combined amount of the entire epoxy resins and the curing agent for epoxy resin; and (B) said adhesive layer is composed of a curable epoxy resin composition comprising an epoxy resin represented by the following structural formula (I), a brominated epoxy resin, an acrylonitrile/butadiene copolymer having carboxyl groups in its molecule which is a solid at room temperature, and a curing agent for epoxy resin in such an amount that the content of the epoxy resin represented by the following structural formula (I) is 5 to 70% by weight based on the amount of the entire epoxy resins, the content of the acrylonitrile/butadiene copolymer is 20 to 70 parts by weight based on 100 parts by weight of the entire epoxy resins and the content of bromine atom is 10 to 30% by weight based on the combined amount of the entire epoxy resins, the acrylonitrile/butadiene copolymer and the curing agent for epoxy resin. u |
| format | Patent |
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and (B) said adhesive layer is composed of a curable epoxy resin composition comprising an epoxy resin represented by the following structural formula (I), a brominated epoxy resin, an acrylonitrile/butadiene copolymer having carboxyl groups in its molecule which is a solid at room temperature, and a curing agent for epoxy resin in such an amount that the content of the epoxy resin represented by the following structural formula (I) is 5 to 70% by weight based on the amount of the entire epoxy resins, the content of the acrylonitrile/butadiene copolymer is 20 to 70 parts by weight based on 100 parts by weight of the entire epoxy resins and the content of bromine atom is 10 to 30% by weight based on the combined amount of the entire epoxy resins, the acrylonitrile/butadiene copolymer and the curing agent for epoxy resin. u</description><edition>5</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; 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and (B) said adhesive layer is composed of a curable epoxy resin composition comprising an epoxy resin represented by the following structural formula (I), a brominated epoxy resin, an acrylonitrile/butadiene copolymer having carboxyl groups in its molecule which is a solid at room temperature, and a curing agent for epoxy resin in such an amount that the content of the epoxy resin represented by the following structural formula (I) is 5 to 70% by weight based on the amount of the entire epoxy resins, the content of the acrylonitrile/butadiene copolymer is 20 to 70 parts by weight based on 100 parts by weight of the entire epoxy resins and the content of bromine atom is 10 to 30% by weight based on the combined amount of the entire epoxy resins, the acrylonitrile/butadiene copolymer and the curing agent for epoxy resin. u</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB3DfCPiFQIcg329NP19A0IcnX3cwxxdVFw93EMDlZw9vEP8VAI9nB1DVHwcAzz9HNXcHTxACoOc1XwcYx0DeJhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAQYmxiYGhsaOxsZEKAEAOQ4p8w</recordid><startdate>19920805</startdate><enddate>19920805</enddate><creator>HORIBA, YASUHIRO</creator><creator>KOHMURA, TOSHIMI</creator><creator>NEMOTO, YOUSUI</creator><creator>ITOH, AKIYOSHI</creator><scope>EVB</scope></search><sort><creationdate>19920805</creationdate><title>EPOXY RESIN-IMPREGNATED GLASS CLOTH SHEET HAVING ADHESIVE LAYER</title><author>HORIBA, YASUHIRO ; KOHMURA, TOSHIMI ; NEMOTO, YOUSUI ; ITOH, AKIYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0434013A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HORIBA, YASUHIRO</creatorcontrib><creatorcontrib>KOHMURA, TOSHIMI</creatorcontrib><creatorcontrib>NEMOTO, YOUSUI</creatorcontrib><creatorcontrib>ITOH, AKIYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HORIBA, YASUHIRO</au><au>KOHMURA, TOSHIMI</au><au>NEMOTO, YOUSUI</au><au>ITOH, AKIYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EPOXY RESIN-IMPREGNATED GLASS CLOTH SHEET HAVING ADHESIVE LAYER</title><date>1992-08-05</date><risdate>1992</risdate><abstract>An epoxy resin-impregnated glass cloth sheet having an adhesive layer provided on at least one side of the surface thereof, characterized in that (A) said epoxy resin-impregnated glass cloth sheet is formed by impregnating glass cloth with a curable epoxy resin composition and curing it, said curable epoxy resin composition comprising an epoxy resin represented by the following structural formula (I), a brominated epoxy resin and a curing agent for epoxy resin in such an amount that the content of the epoxy resin represented by the following structural formula (I) is 5 to 50% by weight based on the amount of the entire epoxy resins and the content of bromine atom is 14 to 30% by weight based on the combined amount of the entire epoxy resins and the curing agent for epoxy resin; and (B) said adhesive layer is composed of a curable epoxy resin composition comprising an epoxy resin represented by the following structural formula (I), a brominated epoxy resin, an acrylonitrile/butadiene copolymer having carboxyl groups in its molecule which is a solid at room temperature, and a curing agent for epoxy resin in such an amount that the content of the epoxy resin represented by the following structural formula (I) is 5 to 70% by weight based on the amount of the entire epoxy resins, the content of the acrylonitrile/butadiene copolymer is 20 to 70 parts by weight based on 100 parts by weight of the entire epoxy resins and the content of bromine atom is 10 to 30% by weight based on the combined amount of the entire epoxy resins, the acrylonitrile/butadiene copolymer and the curing agent for epoxy resin. u</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP |
| title | EPOXY RESIN-IMPREGNATED GLASS CLOTH SHEET HAVING ADHESIVE LAYER |
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