Method and apparatus for bonding component leads to pads located on a non-rigid substrate

Component leads (16) are bonded to pads (14) disposed on a non-rigid substrate (10) by the application of a combination of laser energy and ultrasonic energy. The pads preferably are bare-copper pads, without a noble metal coating or a chemical pretreatment, and the non-rigid substrate is preferably...

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Bibliographische Detailangaben
1. Verfasser:	CHALCO, PEDRO A
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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