Thermally optimized interdigitated transistor
A quasi-interdigitated transistor (50) for rf power applications has a plurality of channel regions (102-118) that are each offset from each other in a y-direction such that a qx heating component from adjacent channel regions will affect any one channel region to a lesser extent than the qx from ad...
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creator | PRITCHETT, SAMUEL D |
description | A quasi-interdigitated transistor (50) for rf power applications has a plurality of channel regions (102-118) that are each offset from each other in a y-direction such that a qx heating component from adjacent channel regions will affect any one channel region to a lesser extent than the qx from adjacent channel regions in the conventional interdigitated structure. In a preferred embodiment, the channel regions (102-118) are formed in a single, curved, V-shaped row such that the cumulative transverse width of all of the transistor sections is less than the waveguide cutoff frequency. The V-shaped row of transistor sections also provides the advantage of parallel signal paths having approximately the same propagation time delay such that there is no phase cancellation within the device. |
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In a preferred embodiment, the channel regions (102-118) are formed in a single, curved, V-shaped row such that the cumulative transverse width of all of the transistor sections is less than the waveguide cutoff frequency. The V-shaped row of transistor sections also provides the advantage of parallel signal paths having approximately the same propagation time delay such that there is no phase cancellation within the device.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910102&DB=EPODOC&CC=EP&NR=0405877A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910102&DB=EPODOC&CC=EP&NR=0405877A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PRITCHETT, SAMUEL D</creatorcontrib><title>Thermally optimized interdigitated transistor</title><description>A quasi-interdigitated transistor (50) for rf power applications has a plurality of channel regions (102-118) that are each offset from each other in a y-direction such that a qx heating component from adjacent channel regions will affect any one channel region to a lesser extent than the qx from adjacent channel regions in the conventional interdigitated structure. In a preferred embodiment, the channel regions (102-118) are formed in a single, curved, V-shaped row such that the cumulative transverse width of all of the transistor sections is less than the waveguide cutoff frequency. The V-shaped row of transistor sections also provides the advantage of parallel signal paths having approximately the same propagation time delay such that there is no phase cancellation within the device.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1991</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNANyUgtyk3MyalUyC8oyczNrEpNUcjMK0ktSslMzyxJLAFyS4oS84ozi0vyi3gYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSbxrgIGJgamFubmjkTERSgDfeCrN</recordid><startdate>19910102</startdate><enddate>19910102</enddate><creator>PRITCHETT, SAMUEL D</creator><scope>EVB</scope></search><sort><creationdate>19910102</creationdate><title>Thermally optimized interdigitated transistor</title><author>PRITCHETT, SAMUEL D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0405877A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1991</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PRITCHETT, SAMUEL D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PRITCHETT, SAMUEL D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermally optimized interdigitated transistor</title><date>1991-01-02</date><risdate>1991</risdate><abstract>A quasi-interdigitated transistor (50) for rf power applications has a plurality of channel regions (102-118) that are each offset from each other in a y-direction such that a qx heating component from adjacent channel regions will affect any one channel region to a lesser extent than the qx from adjacent channel regions in the conventional interdigitated structure. In a preferred embodiment, the channel regions (102-118) are formed in a single, curved, V-shaped row such that the cumulative transverse width of all of the transistor sections is less than the waveguide cutoff frequency. The V-shaped row of transistor sections also provides the advantage of parallel signal paths having approximately the same propagation time delay such that there is no phase cancellation within the device.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Thermally optimized interdigitated transistor |
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