Metallization process

An improved process is described for depositing TiW/TiWN/TiW/Au metallization (18,20,22,24) which provides superior adhesion properties, excellent barrier properties and which is suitable for use with metal line widths of the order of one micron or smaller. It is important in order to obtain these p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LORENZEN, KEVIN ADAM, BURT, DAN LEE, SHUMATE, DAVID ALLEN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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