INTEGRATED CIRCUIT LEAD ASSEMBLY STRUCTURE

An integrated circuit lead assembly structure is disclosed which comprises one or more pc boards (10), having a first lead pattern (40) adjacent one surface of a pc board and a second lead pattern (50) adjacent another surface of a pc board with at least a portion of the leads of the first lead patt...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TSUNGN MU, ALBERT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!