INTEGRATED CIRCUIT LEAD ASSEMBLY STRUCTURE

INTEGRATED CIRCUIT LEAD ASSEMBLY STRUCTURE

An integrated circuit lead assembly structure is disclosed which comprises one or more pc boards (10), having a first lead pattern (40) adjacent one surface of a pc board and a second lead pattern (50) adjacent another surface of a pc board with at least a portion of the leads of the first lead patt...

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1. Verfasser: TSUNGN MU, ALBERT
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description An integrated circuit lead assembly structure is disclosed which comprises one or more pc boards (10), having a first lead pattern (40) adjacent one surface of a pc board and a second lead pattern (50) adjacent another surface of a pc board with at least a portion of the leads of the first lead pattern running perpendicular to corresponding leads of the second lead pattern to reduce crosstalk and coupling between the leads. An array of bonding pads is provided on one surface of the structure together with a die mounting area and electrical connection is made from the bonding pads to leads not on the same surface through vias or plated-through holes which respectively pass through the structure from the bonding pad to the appropriate lead. When a laminate of several pc boards is used, power and/or ground electrodes may be provided on other surfaces and also electrically connected to one or more bonding pads. Means for electrically compensating for the uneven length of the leads are also disclosed as well as decoupling capacitors mounted on the assembly and electrically connected between the power and ground electrodes.
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An array of bonding pads is provided on one surface of the structure together with a die mounting area and electrical connection is made from the bonding pads to leads not on the same surface through vias or plated-through holes which respectively pass through the structure from the bonding pad to the appropriate lead. When a laminate of several pc boards is used, power and/or ground electrodes may be provided on other surfaces and also electrically connected to one or more bonding pads. 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An array of bonding pads is provided on one surface of the structure together with a die mounting area and electrical connection is made from the bonding pads to leads not on the same surface through vias or plated-through holes which respectively pass through the structure from the bonding pad to the appropriate lead. When a laminate of several pc boards is used, power and/or ground electrodes may be provided on other surfaces and also electrically connected to one or more bonding pads. Means for electrically compensating for the uneven length of the leads are also disclosed as well as decoupling capacitors mounted on the assembly and electrically connected between the power and ground electrodes.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title INTEGRATED CIRCUIT LEAD ASSEMBLY STRUCTURE
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