SOLDER COLUMN CONNECTION

A low cost process for fabricating solder column interconnections for an electronic package is described. The process includes the steps of filling an array of pin holes in a pin mold (14) with a lead/tin solder, which array of pin holes is in substantial registration with the array of conductive pa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NEWMAN, BERT HARRISON, MILLER, WILLIAM ROBERT, BEHUN, JOHN RICHARD, YANKOWSKI, EDWARD LOUIS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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