Method of manufacturing base of electromagnetic relay
A method of manufacturing a base (3) of an electromagnetic relay, comprising the steps of: treating a surface of a resinous molded item (4) to a state enabling plating on the surface of the resinous molded item (4) such that the resinous molded item (4) has an upper terminal portion (5a), a lower te...
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creator | KAWASHIMA, KATSUMI |
description | A method of manufacturing a base (3) of an electromagnetic relay, comprising the steps of: treating a surface of a resinous molded item (4) to a state enabling plating on the surface of the resinous molded item (4) such that the resinous molded item (4) has an upper terminal portion (5a), a lower terminal portion (5c) and a side terminal portion (5b) connecting the upper terminal portion (5a) and the lower terminal portion (5c); molding integrally with the resinous molded item (4), resin disabling platirlg thereon such that at least surfaces of the upper terminal portion (5a), the lower terminal portion (5c) and the side terminal portion (5b) are exposed outwardly; and plating an electrically conductive film on only the surfaces of the upper terminal portion (5a), the lower terminal portion (5c) and the side terminal portion (5b). |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP0396098A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP0396098A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP0396098A23</originalsourceid><addsrcrecordid>eNrjZDD1TS3JyE9RyE9TyE3MK01LTC4pLcrMS1dISixOBYmm5qQmlxTl5yam56WWZCYrFKXmJFbyMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5FSg6njXAANjSzMDSwtHI2MilAAAGyEs-Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of manufacturing base of electromagnetic relay</title><source>esp@cenet</source><creator>KAWASHIMA, KATSUMI</creator><creatorcontrib>KAWASHIMA, KATSUMI</creatorcontrib><description>A method of manufacturing a base (3) of an electromagnetic relay, comprising the steps of: treating a surface of a resinous molded item (4) to a state enabling plating on the surface of the resinous molded item (4) such that the resinous molded item (4) has an upper terminal portion (5a), a lower terminal portion (5c) and a side terminal portion (5b) connecting the upper terminal portion (5a) and the lower terminal portion (5c); molding integrally with the resinous molded item (4), resin disabling platirlg thereon such that at least surfaces of the upper terminal portion (5a), the lower terminal portion (5c) and the side terminal portion (5b) are exposed outwardly; and plating an electrically conductive film on only the surfaces of the upper terminal portion (5a), the lower terminal portion (5c) and the side terminal portion (5b).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SWITCHES ; ELECTRICITY ; EMERGENCY PROTECTIVE DEVICES ; RELAYS ; SELECTORS</subject><creationdate>1990</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19901107&DB=EPODOC&CC=EP&NR=0396098A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19901107&DB=EPODOC&CC=EP&NR=0396098A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWASHIMA, KATSUMI</creatorcontrib><title>Method of manufacturing base of electromagnetic relay</title><description>A method of manufacturing a base (3) of an electromagnetic relay, comprising the steps of: treating a surface of a resinous molded item (4) to a state enabling plating on the surface of the resinous molded item (4) such that the resinous molded item (4) has an upper terminal portion (5a), a lower terminal portion (5c) and a side terminal portion (5b) connecting the upper terminal portion (5a) and the lower terminal portion (5c); molding integrally with the resinous molded item (4), resin disabling platirlg thereon such that at least surfaces of the upper terminal portion (5a), the lower terminal portion (5c) and the side terminal portion (5b) are exposed outwardly; and plating an electrically conductive film on only the surfaces of the upper terminal portion (5a), the lower terminal portion (5c) and the side terminal portion (5b).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SWITCHES</subject><subject>ELECTRICITY</subject><subject>EMERGENCY PROTECTIVE DEVICES</subject><subject>RELAYS</subject><subject>SELECTORS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1990</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD1TS3JyE9RyE9TyE3MK01LTC4pLcrMS1dISixOBYmm5qQmlxTl5yam56WWZCYrFKXmJFbyMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5FSg6njXAANjSzMDSwtHI2MilAAAGyEs-Q</recordid><startdate>19901107</startdate><enddate>19901107</enddate><creator>KAWASHIMA, KATSUMI</creator><scope>EVB</scope></search><sort><creationdate>19901107</creationdate><title>Method of manufacturing base of electromagnetic relay</title><author>KAWASHIMA, KATSUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0396098A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1990</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SWITCHES</topic><topic>ELECTRICITY</topic><topic>EMERGENCY PROTECTIVE DEVICES</topic><topic>RELAYS</topic><topic>SELECTORS</topic><toplevel>online_resources</toplevel><creatorcontrib>KAWASHIMA, KATSUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAWASHIMA, KATSUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of manufacturing base of electromagnetic relay</title><date>1990-11-07</date><risdate>1990</risdate><abstract>A method of manufacturing a base (3) of an electromagnetic relay, comprising the steps of: treating a surface of a resinous molded item (4) to a state enabling plating on the surface of the resinous molded item (4) such that the resinous molded item (4) has an upper terminal portion (5a), a lower terminal portion (5c) and a side terminal portion (5b) connecting the upper terminal portion (5a) and the lower terminal portion (5c); molding integrally with the resinous molded item (4), resin disabling platirlg thereon such that at least surfaces of the upper terminal portion (5a), the lower terminal portion (5c) and the side terminal portion (5b) are exposed outwardly; and plating an electrically conductive film on only the surfaces of the upper terminal portion (5a), the lower terminal portion (5c) and the side terminal portion (5b).</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
recordid | cdi_epo_espacenet_EP0396098A2 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SWITCHES ELECTRICITY EMERGENCY PROTECTIVE DEVICES RELAYS SELECTORS |
title | Method of manufacturing base of electromagnetic relay |
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