BISBENZOCYCLOBUTENE MONOMER, PROCESS FOR THE PREPARATION THEREOF AND BENZOCYCLOBUTENE-BASED DIE ATTACH ADHESIVE COMPOSITIONS
La présente invention se rapporte à une composition adhésive pour la fixation de dés, comprenant un mélange homogène fait d'un monomère de bibenzocyclobutène couplé en pont avec un organopolysiloxane, d'un auxiliaire d'adhérence à base d'organosilane et d'un métal électrocon...
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| creator | GROS, WILLIAM, A |
| description | La présente invention se rapporte à une composition adhésive pour la fixation de dés, comprenant un mélange homogène fait d'un monomère de bibenzocyclobutène couplé en pont avec un organopolysiloxane, d'un auxiliaire d'adhérence à base d'organosilane et d'un métal électroconducteur en fines particules. La composition est facile à appliquer, présente une bonne adhérence et une bonne stabilité thermique à hautes températures et ne nécessite pas de solvants, d'excitants ou d'agents de polymérisation. La perte de poids lors de la polymérisation est minime.
The invention is a die attach adhesive composition comprising a homogeneous blend of an organopolysiloxane-bridged bisbenzocyclobutene monomer, an organosilane adhesion aid, and a finely divided electrically conductive metal. The composition is easy to apply, exhibits good adhesive strength and thermal stability at high temperatures, and does not require solvents, initiators, or curing agents. Weight loss on cure is minimal. |
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The invention is a die attach adhesive composition comprising a homogeneous blend of an organopolysiloxane-bridged bisbenzocyclobutene monomer, an organosilane adhesion aid, and a finely divided electrically conductive metal. The composition is easy to apply, exhibits good adhesive strength and thermal stability at high temperatures, and does not require solvents, initiators, or curing agents. Weight loss on cure is minimal.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; CONDUCTORS ; DYES ; ELECTRICITY ; INSULATORS ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>1990</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19900613&DB=EPODOC&CC=EP&NR=0372000A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19900613&DB=EPODOC&CC=EP&NR=0372000A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GROS, WILLIAM, A</creatorcontrib><title>BISBENZOCYCLOBUTENE MONOMER, PROCESS FOR THE PREPARATION THEREOF AND BENZOCYCLOBUTENE-BASED DIE ATTACH ADHESIVE COMPOSITIONS</title><description>La présente invention se rapporte à une composition adhésive pour la fixation de dés, comprenant un mélange homogène fait d'un monomère de bibenzocyclobutène couplé en pont avec un organopolysiloxane, d'un auxiliaire d'adhérence à base d'organosilane et d'un métal électroconducteur en fines particules. La composition est facile à appliquer, présente une bonne adhérence et une bonne stabilité thermique à hautes températures et ne nécessite pas de solvants, d'excitants ou d'agents de polymérisation. La perte de poids lors de la polymérisation est minime.
The invention is a die attach adhesive composition comprising a homogeneous blend of an organopolysiloxane-bridged bisbenzocyclobutene monomer, an organosilane adhesion aid, and a finely divided electrically conductive metal. The composition is easy to apply, exhibits good adhesive strength and thermal stability at high temperatures, and does not require solvents, initiators, or curing agents. Weight loss on cure is minimal.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CONDUCTORS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1990</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKwjAUALs4iPoP7wMsRDs4vyQvJGDzQhIFXUqROIkW6ujHa8HJyek4OG5evaRLkvyZ1UntWR4yeYKWPbcU1xAiK0oJDEfIlj5OASNmx37ySGwAvYbfQy0xkQbtCDBnVBZQW0ruSKC4DZzctEjLanbtb2NZfbmowFBWti7Doyvj0F_KvTw7CqLZbYUQuGn-SN5dejsP</recordid><startdate>19900613</startdate><enddate>19900613</enddate><creator>GROS, WILLIAM, A</creator><scope>EVB</scope></search><sort><creationdate>19900613</creationdate><title>BISBENZOCYCLOBUTENE MONOMER, PROCESS FOR THE PREPARATION THEREOF AND BENZOCYCLOBUTENE-BASED DIE ATTACH ADHESIVE COMPOSITIONS</title><author>GROS, WILLIAM, A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0372000A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1990</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CONDUCTORS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>GROS, WILLIAM, A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GROS, WILLIAM, A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BISBENZOCYCLOBUTENE MONOMER, PROCESS FOR THE PREPARATION THEREOF AND BENZOCYCLOBUTENE-BASED DIE ATTACH ADHESIVE COMPOSITIONS</title><date>1990-06-13</date><risdate>1990</risdate><abstract>La présente invention se rapporte à une composition adhésive pour la fixation de dés, comprenant un mélange homogène fait d'un monomère de bibenzocyclobutène couplé en pont avec un organopolysiloxane, d'un auxiliaire d'adhérence à base d'organosilane et d'un métal électroconducteur en fines particules. La composition est facile à appliquer, présente une bonne adhérence et une bonne stabilité thermique à hautes températures et ne nécessite pas de solvants, d'excitants ou d'agents de polymérisation. La perte de poids lors de la polymérisation est minime.
The invention is a die attach adhesive composition comprising a homogeneous blend of an organopolysiloxane-bridged bisbenzocyclobutene monomer, an organosilane adhesion aid, and a finely divided electrically conductive metal. The composition is easy to apply, exhibits good adhesive strength and thermal stability at high temperatures, and does not require solvents, initiators, or curing agents. Weight loss on cure is minimal.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS DYES ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | BISBENZOCYCLOBUTENE MONOMER, PROCESS FOR THE PREPARATION THEREOF AND BENZOCYCLOBUTENE-BASED DIE ATTACH ADHESIVE COMPOSITIONS |
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