Corrosion resistance enhancing electroplating process, and plated article

To simplify manufacture of plated metal parts with high corrosive resistance, especially suitable for use as sealing lids or cover elements for semiconductor packages, a substrate (12) of Kovar, or Alloy 42, which are nickel-containing iron alloys, are electroplated with a base layer (14) of a metal...

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1. Verfasser: LEVINE, SAMUEL W
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description To simplify manufacture of plated metal parts with high corrosive resistance, especially suitable for use as sealing lids or cover elements for semiconductor packages, a substrate (12) of Kovar, or Alloy 42, which are nickel-containing iron alloys, are electroplated with a base layer (14) of a metal having an electromotive potential high with respect to that of the substrate, over which an intermediate layer is electroplated. The intermediate layer (16) has an electromotive potential which is low with respect to the base layer; and over that a cover layer (18) is plated which has an electromotive potential similar to that of the base layer. A difference of about 1.2 volts of electromotive potential between the intermediate layer (16) with respect to the base layer (14) and the cover layer (18) is desirable. Suitable metals are gold-nickel-gold combinations, in which the gold layers should be over 10 microinches (0.25 micrometer) thick, preferably and in order to meet MIL-STD 883C, about 25 to 50 microinches (0.64 to 1 .27 micrometers) thick. The intermediate nickel layer (16), and preferably about 150 microinches (3.82 micrometers) thick, has an electromotive potential which is at the negative side of the electromotive series. Pin holes through the three layers may cause, under the influence of a corrosive atmosphere, migration of ions up to the base layer but, due to the arrangement of electromotive potential of the intermediate layer (16) and the cover layer (18), will not extend further so that the corroded substrate material will, effectively, form a plug for the pin hole and prevent progression of corrosion.
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The intermediate layer (16) has an electromotive potential which is low with respect to the base layer; and over that a cover layer (18) is plated which has an electromotive potential similar to that of the base layer. A difference of about 1.2 volts of electromotive potential between the intermediate layer (16) with respect to the base layer (14) and the cover layer (18) is desirable. Suitable metals are gold-nickel-gold combinations, in which the gold layers should be over 10 microinches (0.25 micrometer) thick, preferably and in order to meet MIL-STD 883C, about 25 to 50 microinches (0.64 to 1 .27 micrometers) thick. The intermediate nickel layer (16), and preferably about 150 microinches (3.82 micrometers) thick, has an electromotive potential which is at the negative side of the electromotive series. Pin holes through the three layers may cause, under the influence of a corrosive atmosphere, migration of ions up to the base layer but, due to the arrangement of electromotive potential of the intermediate layer (16) and the cover layer (18), will not extend further so that the corroded substrate material will, effectively, form a plug for the pin hole and prevent progression of corrosion.</abstract><oa>free_for_read</oa></addata></record>
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
PERFORMING OPERATIONS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
TRANSPORTING
title Corrosion resistance enhancing electroplating process, and plated article
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