Corrosion resistance enhancing electroplating process, and plated article
To simplify manufacture of plated metal parts with high corrosive resistance, especially suitable for use as sealing lids or cover elements for semiconductor packages, a substrate (12) of Kovar, or Alloy 42, which are nickel-containing iron alloys, are electroplated with a base layer (14) of a metal...
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description | To simplify manufacture of plated metal parts with high corrosive resistance, especially suitable for use as sealing lids or cover elements for semiconductor packages, a substrate (12) of Kovar, or Alloy 42, which are nickel-containing iron alloys, are electroplated with a base layer (14) of a metal having an electromotive potential high with respect to that of the substrate, over which an intermediate layer is electroplated. The intermediate layer (16) has an electromotive potential which is low with respect to the base layer; and over that a cover layer (18) is plated which has an electromotive potential similar to that of the base layer. A difference of about 1.2 volts of electromotive potential between the intermediate layer (16) with respect to the base layer (14) and the cover layer (18) is desirable. Suitable metals are gold-nickel-gold combinations, in which the gold layers should be over 10 microinches (0.25 micrometer) thick, preferably and in order to meet MIL-STD 883C, about 25 to 50 microinches (0.64 to 1 .27 micrometers) thick. The intermediate nickel layer (16), and preferably about 150 microinches (3.82 micrometers) thick, has an electromotive potential which is at the negative side of the electromotive series. Pin holes through the three layers may cause, under the influence of a corrosive atmosphere, migration of ions up to the base layer but, due to the arrangement of electromotive potential of the intermediate layer (16) and the cover layer (18), will not extend further so that the corroded substrate material will, effectively, form a plug for the pin hole and prevent progression of corrosion. |
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The intermediate layer (16) has an electromotive potential which is low with respect to the base layer; and over that a cover layer (18) is plated which has an electromotive potential similar to that of the base layer. A difference of about 1.2 volts of electromotive potential between the intermediate layer (16) with respect to the base layer (14) and the cover layer (18) is desirable. Suitable metals are gold-nickel-gold combinations, in which the gold layers should be over 10 microinches (0.25 micrometer) thick, preferably and in order to meet MIL-STD 883C, about 25 to 50 microinches (0.64 to 1 .27 micrometers) thick. The intermediate nickel layer (16), and preferably about 150 microinches (3.82 micrometers) thick, has an electromotive potential which is at the negative side of the electromotive series. Pin holes through the three layers may cause, under the influence of a corrosive atmosphere, migration of ions up to the base layer but, due to the arrangement of electromotive potential of the intermediate layer (16) and the cover layer (18), will not extend further so that the corroded substrate material will, effectively, form a plug for the pin hole and prevent progression of corrosion.</description><language>eng ; fre ; ger</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; PERFORMING OPERATIONS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS ; TRANSPORTING</subject><creationdate>1989</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19891018&DB=EPODOC&CC=EP&NR=0337015A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19891018&DB=EPODOC&CC=EP&NR=0337015A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEVINE, SAMUEL W</creatorcontrib><title>Corrosion resistance enhancing electroplating process, and plated article</title><description>To simplify manufacture of plated metal parts with high corrosive resistance, especially suitable for use as sealing lids or cover elements for semiconductor packages, a substrate (12) of Kovar, or Alloy 42, which are nickel-containing iron alloys, are electroplated with a base layer (14) of a metal having an electromotive potential high with respect to that of the substrate, over which an intermediate layer is electroplated. The intermediate layer (16) has an electromotive potential which is low with respect to the base layer; and over that a cover layer (18) is plated which has an electromotive potential similar to that of the base layer. A difference of about 1.2 volts of electromotive potential between the intermediate layer (16) with respect to the base layer (14) and the cover layer (18) is desirable. Suitable metals are gold-nickel-gold combinations, in which the gold layers should be over 10 microinches (0.25 micrometer) thick, preferably and in order to meet MIL-STD 883C, about 25 to 50 microinches (0.64 to 1 .27 micrometers) thick. The intermediate nickel layer (16), and preferably about 150 microinches (3.82 micrometers) thick, has an electromotive potential which is at the negative side of the electromotive series. Pin holes through the three layers may cause, under the influence of a corrosive atmosphere, migration of ions up to the base layer but, due to the arrangement of electromotive potential of the intermediate layer (16) and the cover layer (18), will not extend further so that the corroded substrate material will, effectively, form a plug for the pin hole and prevent progression of corrosion.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1989</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijEKAjEQRdNYiHqHOYDCLkGsZVnRzsJ-GbJfDYSZMJP7owsewOrxHm8dboOaqWcVMnj2xpJAkPeXWV6EgtRMa-G2aDVNcN8Ty0xLxExsLaeCbVg9uTh2P24CXcbHcD2g6gSvnCBo03jvYjx1_fHcxz-WD9LPNNE</recordid><startdate>19891018</startdate><enddate>19891018</enddate><creator>LEVINE, SAMUEL W</creator><scope>EVB</scope></search><sort><creationdate>19891018</creationdate><title>Corrosion resistance enhancing electroplating process, and plated article</title><author>LEVINE, SAMUEL W</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0337015A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1989</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LEVINE, SAMUEL W</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEVINE, SAMUEL W</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Corrosion resistance enhancing electroplating process, and plated article</title><date>1989-10-18</date><risdate>1989</risdate><abstract>To simplify manufacture of plated metal parts with high corrosive resistance, especially suitable for use as sealing lids or cover elements for semiconductor packages, a substrate (12) of Kovar, or Alloy 42, which are nickel-containing iron alloys, are electroplated with a base layer (14) of a metal having an electromotive potential high with respect to that of the substrate, over which an intermediate layer is electroplated. The intermediate layer (16) has an electromotive potential which is low with respect to the base layer; and over that a cover layer (18) is plated which has an electromotive potential similar to that of the base layer. A difference of about 1.2 volts of electromotive potential between the intermediate layer (16) with respect to the base layer (14) and the cover layer (18) is desirable. Suitable metals are gold-nickel-gold combinations, in which the gold layers should be over 10 microinches (0.25 micrometer) thick, preferably and in order to meet MIL-STD 883C, about 25 to 50 microinches (0.64 to 1 .27 micrometers) thick. The intermediate nickel layer (16), and preferably about 150 microinches (3.82 micrometers) thick, has an electromotive potential which is at the negative side of the electromotive series. Pin holes through the three layers may cause, under the influence of a corrosive atmosphere, migration of ions up to the base layer but, due to the arrangement of electromotive potential of the intermediate layer (16) and the cover layer (18), will not extend further so that the corroded substrate material will, effectively, form a plug for the pin hole and prevent progression of corrosion.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORTING |
title | Corrosion resistance enhancing electroplating process, and plated article |
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