Radiation-sensitive photoresist composition for exposure to deep ultraviolet radiation

This invention relates to a new radiation-sensitive photoresist composition comprising an organic film-forming material and a radiation-sensitive compound which liberates a carboxylic acid on exposure to deep ultraviolet radiation and which is characterized in that said radiation-sensitive compound...

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Bibliographische Detailangaben
Hauptverfasser:	USIFER, DOUGLAS A, KELLY, MICHAEL G
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	This invention relates to a new radiation-sensitive photoresist composition comprising an organic film-forming material and a radiation-sensitive compound which liberates a carboxylic acid on exposure to deep ultraviolet radiation and which is characterized in that said radiation-sensitive compound is an oxime carboxylic ester of the general formula I or II The invention relates also to a process for formation of an image. The image-forming process may be used in the production of printing plates and microelectronic circuits.