Electrically conductive pressure-sensitive adhesive tape
Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to intercon...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | FLEMING, MAURICE J RENSTROM, RICHARD L FOSS, GEORGE D CALHOUN, CLYDE D |
| description | Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 mu m thick. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP0330452A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP0330452A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP0330452A23</originalsourceid><addsrcrecordid>eNrjZLBwzUlNLinKTE7MyalUSM7PSylNLsksS1UoKEotLi4tStUtTs0rzgQLJaZkpBaDGCWJBak8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDA2NjAxNTI0ciYCCUAFFgurw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electrically conductive pressure-sensitive adhesive tape</title><source>esp@cenet</source><creator>FLEMING, MAURICE J ; RENSTROM, RICHARD L ; FOSS, GEORGE D ; CALHOUN, CLYDE D</creator><creatorcontrib>FLEMING, MAURICE J ; RENSTROM, RICHARD L ; FOSS, GEORGE D ; CALHOUN, CLYDE D</creatorcontrib><description>Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 mu m thick.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CONDUCTORS ; CURRENT COLLECTORS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>1989</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19890830&DB=EPODOC&CC=EP&NR=0330452A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19890830&DB=EPODOC&CC=EP&NR=0330452A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FLEMING, MAURICE J</creatorcontrib><creatorcontrib>RENSTROM, RICHARD L</creatorcontrib><creatorcontrib>FOSS, GEORGE D</creatorcontrib><creatorcontrib>CALHOUN, CLYDE D</creatorcontrib><title>Electrically conductive pressure-sensitive adhesive tape</title><description>Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 mu m thick.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>CURRENT COLLECTORS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1989</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBwzUlNLinKTE7MyalUSM7PSylNLsksS1UoKEotLi4tStUtTs0rzgQLJaZkpBaDGCWJBak8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDA2NjAxNTI0ciYCCUAFFgurw</recordid><startdate>19890830</startdate><enddate>19890830</enddate><creator>FLEMING, MAURICE J</creator><creator>RENSTROM, RICHARD L</creator><creator>FOSS, GEORGE D</creator><creator>CALHOUN, CLYDE D</creator><scope>EVB</scope></search><sort><creationdate>19890830</creationdate><title>Electrically conductive pressure-sensitive adhesive tape</title><author>FLEMING, MAURICE J ; RENSTROM, RICHARD L ; FOSS, GEORGE D ; CALHOUN, CLYDE D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0330452A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1989</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>CURRENT COLLECTORS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>FLEMING, MAURICE J</creatorcontrib><creatorcontrib>RENSTROM, RICHARD L</creatorcontrib><creatorcontrib>FOSS, GEORGE D</creatorcontrib><creatorcontrib>CALHOUN, CLYDE D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FLEMING, MAURICE J</au><au>RENSTROM, RICHARD L</au><au>FOSS, GEORGE D</au><au>CALHOUN, CLYDE D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electrically conductive pressure-sensitive adhesive tape</title><date>1989-08-30</date><risdate>1989</risdate><abstract>Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 mu m thick.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP0330452A2 |
| source | esp@cenet |
| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES |
| title | Electrically conductive pressure-sensitive adhesive tape |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T22%3A12%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FLEMING,%20MAURICE%20J&rft.date=1989-08-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP0330452A2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |