Compensating element for thermal or mechanical strain, especially for a printed circuit, and process for making such an element for use in a printed circuit
Elément de compensation caractérisé en ce qu'il est constitué partiellement ou complètement d'un alliage pseudoélastique ou à mémoire de forme subissant de façon réversible des déformations importantes, même sous de très faibles contraintes et utilisé notamment dans les circuits imprimés....
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| creator | EBERHARDT, ANDRE DOMINIAK, SERGE GUYON, PIERRE YVES ROBERT BERVEILLER, MARCEL LUCAS, JEAN PIERRE |
| description | Elément de compensation caractérisé en ce qu'il est constitué partiellement ou complètement d'un alliage pseudoélastique ou à mémoire de forme subissant de façon réversible des déformations importantes, même sous de très faibles contraintes et utilisé notamment dans les circuits imprimés.
A printed circuit comprising an electrically insulating substrate and an electrically conductive layer on the substrate, this layer being a pseudo-elastic or elastically deformable alloy that undergoes significant deformations in a reversible manner and is a copper alloy containing at least 50% by weight copper in the form of large-grained polycrystals that undergo martensitic transformation. Preferably, the layer contains 60-80% by weight of copper, the large-grained polycrystals having a grain size of at least about 3 mm. The martensitic transformation takes place within the temperature range -55 DEG C. to +125 DEG C., and the layer has a thickness between 30 mu and 200 mu , preferably about 100 mu . |
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A printed circuit comprising an electrically insulating substrate and an electrically conductive layer on the substrate, this layer being a pseudo-elastic or elastically deformable alloy that undergoes significant deformations in a reversible manner and is a copper alloy containing at least 50% by weight copper in the form of large-grained polycrystals that undergo martensitic transformation. Preferably, the layer contains 60-80% by weight of copper, the large-grained polycrystals having a grain size of at least about 3 mm. The martensitic transformation takes place within the temperature range -55 DEG C. to +125 DEG C., and the layer has a thickness between 30 mu and 200 mu , preferably about 100 mu .</description><edition>4</edition><language>eng ; fre ; ger</language><subject>ARTIFICIAL STONE ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CEMENTS ; CERAMICS ; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; LIME, MAGNESIA ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MINERAL OR SLAG WOOL ; PRINTED CIRCUITS ; REFRACTORIES ; SEMICONDUCTOR DEVICES ; SLAG ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; TREATMENT OF NATURAL STONE</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880518&DB=EPODOC&CC=EP&NR=0267862A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880518&DB=EPODOC&CC=EP&NR=0267862A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>EBERHARDT, ANDRE</creatorcontrib><creatorcontrib>DOMINIAK, SERGE</creatorcontrib><creatorcontrib>GUYON, PIERRE YVES ROBERT</creatorcontrib><creatorcontrib>BERVEILLER, MARCEL</creatorcontrib><creatorcontrib>LUCAS, JEAN PIERRE</creatorcontrib><title>Compensating element for thermal or mechanical strain, especially for a printed circuit, and process for making such an element for use in a printed circuit</title><description>Elément de compensation caractérisé en ce qu'il est constitué partiellement ou complètement d'un alliage pseudoélastique ou à mémoire de forme subissant de façon réversible des déformations importantes, même sous de très faibles contraintes et utilisé notamment dans les circuits imprimés.
A printed circuit comprising an electrically insulating substrate and an electrically conductive layer on the substrate, this layer being a pseudo-elastic or elastically deformable alloy that undergoes significant deformations in a reversible manner and is a copper alloy containing at least 50% by weight copper in the form of large-grained polycrystals that undergo martensitic transformation. Preferably, the layer contains 60-80% by weight of copper, the large-grained polycrystals having a grain size of at least about 3 mm. The martensitic transformation takes place within the temperature range -55 DEG C. to +125 DEG C., and the layer has a thickness between 30 mu and 200 mu , preferably about 100 mu .</description><subject>ARTIFICIAL STONE</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CEMENTS</subject><subject>CERAMICS</subject><subject>CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</subject><subject>CONCRETE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>GLASS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>LIME, MAGNESIA</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PRINTED CIRCUITS</subject><subject>REFRACTORIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SLAG</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>TREATMENT OF NATURAL STONE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1988</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjjEOwjAMRbswIOAOPkCRoEiFFVVFjAzsleW61CJxqiQduAuHJVQsiIXp299P_n-ePStnB9aAUfQGbNiyRuich9izt2ggjZapRxVKW4geRXPgMDAJGvOYYITBi0ZugcTTKDEH1DaZjjiECbF4f0eEkfp0-4oaA4Po75NlNuvQBF59dJHBqb5W5zUPrkkNkFg5NvVlU5T7Q1kct7s_kBfkKVLL</recordid><startdate>19880518</startdate><enddate>19880518</enddate><creator>EBERHARDT, ANDRE</creator><creator>DOMINIAK, SERGE</creator><creator>GUYON, PIERRE YVES ROBERT</creator><creator>BERVEILLER, MARCEL</creator><creator>LUCAS, JEAN PIERRE</creator><scope>EVB</scope></search><sort><creationdate>19880518</creationdate><title>Compensating element for thermal or mechanical strain, especially for a printed circuit, and process for making such an element for use in a printed circuit</title><author>EBERHARDT, ANDRE ; DOMINIAK, SERGE ; GUYON, PIERRE YVES ROBERT ; BERVEILLER, MARCEL ; LUCAS, JEAN PIERRE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0267862A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1988</creationdate><topic>ARTIFICIAL STONE</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CEMENTS</topic><topic>CERAMICS</topic><topic>CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</topic><topic>CONCRETE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>GLASS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>LIME, MAGNESIA</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PRINTED CIRCUITS</topic><topic>REFRACTORIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SLAG</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>TREATMENT OF NATURAL STONE</topic><toplevel>online_resources</toplevel><creatorcontrib>EBERHARDT, ANDRE</creatorcontrib><creatorcontrib>DOMINIAK, SERGE</creatorcontrib><creatorcontrib>GUYON, PIERRE YVES ROBERT</creatorcontrib><creatorcontrib>BERVEILLER, MARCEL</creatorcontrib><creatorcontrib>LUCAS, JEAN PIERRE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>EBERHARDT, ANDRE</au><au>DOMINIAK, SERGE</au><au>GUYON, PIERRE YVES ROBERT</au><au>BERVEILLER, MARCEL</au><au>LUCAS, JEAN PIERRE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Compensating element for thermal or mechanical strain, especially for a printed circuit, and process for making such an element for use in a printed circuit</title><date>1988-05-18</date><risdate>1988</risdate><abstract>Elément de compensation caractérisé en ce qu'il est constitué partiellement ou complètement d'un alliage pseudoélastique ou à mémoire de forme subissant de façon réversible des déformations importantes, même sous de très faibles contraintes et utilisé notamment dans les circuits imprimés.
A printed circuit comprising an electrically insulating substrate and an electrically conductive layer on the substrate, this layer being a pseudo-elastic or elastically deformable alloy that undergoes significant deformations in a reversible manner and is a copper alloy containing at least 50% by weight copper in the form of large-grained polycrystals that undergo martensitic transformation. Preferably, the layer contains 60-80% by weight of copper, the large-grained polycrystals having a grain size of at least about 3 mm. The martensitic transformation takes place within the temperature range -55 DEG C. to +125 DEG C., and the layer has a thickness between 30 mu and 200 mu , preferably about 100 mu .</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL PRINTED CIRCUITS REFRACTORIES SEMICONDUCTOR DEVICES SLAG SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TREATMENT OF ALLOYS OR NON-FERROUS METALS TREATMENT OF NATURAL STONE |
| title | Compensating element for thermal or mechanical strain, especially for a printed circuit, and process for making such an element for use in a printed circuit |
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