IMPROVED SILICON PACKAGES FOR POWER SEMICONDUCTOR DEVICES

A hermetically sealed package (24) for a power semiconductor wafer (22) is provided comprising substantially entirely silicon materials selected to have coefficients of thermal expansion closely matching that of the power semiconductor wafer. A semiconductor wafer (22) such as a power diode comprise...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NEUGEBAUER, CONSTANTINE ALOIS, SELIM, FADEL ABDEL-AZIZ, GLASCOCK, HOMER HOPSON II, PICCONE, DANTE EDMOND, MUELLER, DAVID LEONARD, WEBSTER, HAROLD FRANK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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