Method and device employing input and output staging chamber devices for reduced pressure lamination
In this method for reduced pressure lamination of a light sensitive material (44) in film form to a printed circuit base board (2), when adhering the light sensitive material in film form comprising a flexible support either continuous or cut to the dimensions of the base board and a light sensitive...
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| creator | HAYASHI, NOBUYUKI SATOU, TADAJI TOMISAWA, YOSHIAKI MIYAMAE, YUSUKE HITACHI KASEI SETSUBI KENETSU K.K |
| description | In this method for reduced pressure lamination of a light sensitive material (44) in film form to a printed circuit base board (2), when adhering the light sensitive material in film form comprising a flexible support either continuous or cut to the dimensions of the base board and a light sensitive layer to the printed circuit base board (2) under reduced pressure, a main container (9) for carrying out the adhesion and an intake container (8) and an exit container (10) connected thereto are provided, the base board (2) is supplied to the intake container (8) set to atmospheric pressure, and thereafter the pressure in the intake container (8) is reduced, next the base board (2) is supplied Into the main container (9) at reduced pressure and the light sensitive material (44) in film form is adhered to the base board (2), next the light sensitive material (44) in film form Is in the case that it is continuous cut to the dimensions of the base board (2), and after supplying the base board (2) to which the light sensitive material (44) in film form has been adhered to the exit container (10) at reduced pressure, the exit container (10) is set to atmospheric pressure and the base board (2) to which the light sensitive material (44) in film form has been adhered is ejected from the exit container (10). A reduced pressure adhesion device is also described for performing the method. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP0215358A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP0215358A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP0215358A23</originalsourceid><addsrcrecordid>eNqNizsKwkAURdNYiLqHtwFBEwK2IhEbwcI-PGdukoH5MfNGcPcSyQKszoVzz7rSd8gUNLHXpPE2CgQXbfgYP5LxschPhSLzzMLjLNTE7oW0FJmGkChBFwVNMSHnkkCWnfEsJvhttRrYZuwWbiq6ds_LbY8YeuTICh7Sd49DfWyb9nSumz8uX41dPts</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method and device employing input and output staging chamber devices for reduced pressure lamination</title><source>esp@cenet</source><creator>HAYASHI, NOBUYUKI ; SATOU, TADAJI ; TOMISAWA, YOSHIAKI ; MIYAMAE, YUSUKE HITACHI KASEI SETSUBI KENETSU K.K</creator><creatorcontrib>HAYASHI, NOBUYUKI ; SATOU, TADAJI ; TOMISAWA, YOSHIAKI ; MIYAMAE, YUSUKE HITACHI KASEI SETSUBI KENETSU K.K</creatorcontrib><description>In this method for reduced pressure lamination of a light sensitive material (44) in film form to a printed circuit base board (2), when adhering the light sensitive material in film form comprising a flexible support either continuous or cut to the dimensions of the base board and a light sensitive layer to the printed circuit base board (2) under reduced pressure, a main container (9) for carrying out the adhesion and an intake container (8) and an exit container (10) connected thereto are provided, the base board (2) is supplied to the intake container (8) set to atmospheric pressure, and thereafter the pressure in the intake container (8) is reduced, next the base board (2) is supplied Into the main container (9) at reduced pressure and the light sensitive material (44) in film form is adhered to the base board (2), next the light sensitive material (44) in film form Is in the case that it is continuous cut to the dimensions of the base board (2), and after supplying the base board (2) to which the light sensitive material (44) in film form has been adhered to the exit container (10) at reduced pressure, the exit container (10) is set to atmospheric pressure and the base board (2) to which the light sensitive material (44) in film form has been adhered is ejected from the exit container (10). A reduced pressure adhesion device is also described for performing the method.</description><language>eng ; fre ; ger</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CINEMATOGRAPHY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>1987</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19870325&DB=EPODOC&CC=EP&NR=0215358A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19870325&DB=EPODOC&CC=EP&NR=0215358A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAYASHI, NOBUYUKI</creatorcontrib><creatorcontrib>SATOU, TADAJI</creatorcontrib><creatorcontrib>TOMISAWA, YOSHIAKI</creatorcontrib><creatorcontrib>MIYAMAE, YUSUKE HITACHI KASEI SETSUBI KENETSU K.K</creatorcontrib><title>Method and device employing input and output staging chamber devices for reduced pressure lamination</title><description>In this method for reduced pressure lamination of a light sensitive material (44) in film form to a printed circuit base board (2), when adhering the light sensitive material in film form comprising a flexible support either continuous or cut to the dimensions of the base board and a light sensitive layer to the printed circuit base board (2) under reduced pressure, a main container (9) for carrying out the adhesion and an intake container (8) and an exit container (10) connected thereto are provided, the base board (2) is supplied to the intake container (8) set to atmospheric pressure, and thereafter the pressure in the intake container (8) is reduced, next the base board (2) is supplied Into the main container (9) at reduced pressure and the light sensitive material (44) in film form is adhered to the base board (2), next the light sensitive material (44) in film form Is in the case that it is continuous cut to the dimensions of the base board (2), and after supplying the base board (2) to which the light sensitive material (44) in film form has been adhered to the exit container (10) at reduced pressure, the exit container (10) is set to atmospheric pressure and the base board (2) to which the light sensitive material (44) in film form has been adhered is ejected from the exit container (10). A reduced pressure adhesion device is also described for performing the method.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1987</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNizsKwkAURdNYiLqHtwFBEwK2IhEbwcI-PGdukoH5MfNGcPcSyQKszoVzz7rSd8gUNLHXpPE2CgQXbfgYP5LxschPhSLzzMLjLNTE7oW0FJmGkChBFwVNMSHnkkCWnfEsJvhttRrYZuwWbiq6ds_LbY8YeuTICh7Sd49DfWyb9nSumz8uX41dPts</recordid><startdate>19870325</startdate><enddate>19870325</enddate><creator>HAYASHI, NOBUYUKI</creator><creator>SATOU, TADAJI</creator><creator>TOMISAWA, YOSHIAKI</creator><creator>MIYAMAE, YUSUKE HITACHI KASEI SETSUBI KENETSU K.K</creator><scope>EVB</scope></search><sort><creationdate>19870325</creationdate><title>Method and device employing input and output staging chamber devices for reduced pressure lamination</title><author>HAYASHI, NOBUYUKI ; SATOU, TADAJI ; TOMISAWA, YOSHIAKI ; MIYAMAE, YUSUKE HITACHI KASEI SETSUBI KENETSU K.K</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0215358A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1987</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>HAYASHI, NOBUYUKI</creatorcontrib><creatorcontrib>SATOU, TADAJI</creatorcontrib><creatorcontrib>TOMISAWA, YOSHIAKI</creatorcontrib><creatorcontrib>MIYAMAE, YUSUKE HITACHI KASEI SETSUBI KENETSU K.K</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAYASHI, NOBUYUKI</au><au>SATOU, TADAJI</au><au>TOMISAWA, YOSHIAKI</au><au>MIYAMAE, YUSUKE HITACHI KASEI SETSUBI KENETSU K.K</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and device employing input and output staging chamber devices for reduced pressure lamination</title><date>1987-03-25</date><risdate>1987</risdate><abstract>In this method for reduced pressure lamination of a light sensitive material (44) in film form to a printed circuit base board (2), when adhering the light sensitive material in film form comprising a flexible support either continuous or cut to the dimensions of the base board and a light sensitive layer to the printed circuit base board (2) under reduced pressure, a main container (9) for carrying out the adhesion and an intake container (8) and an exit container (10) connected thereto are provided, the base board (2) is supplied to the intake container (8) set to atmospheric pressure, and thereafter the pressure in the intake container (8) is reduced, next the base board (2) is supplied Into the main container (9) at reduced pressure and the light sensitive material (44) in film form is adhered to the base board (2), next the light sensitive material (44) in film form Is in the case that it is continuous cut to the dimensions of the base board (2), and after supplying the base board (2) to which the light sensitive material (44) in film form has been adhered to the exit container (10) at reduced pressure, the exit container (10) is set to atmospheric pressure and the base board (2) to which the light sensitive material (44) in film form has been adhered is ejected from the exit container (10). A reduced pressure adhesion device is also described for performing the method.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Method and device employing input and output staging chamber devices for reduced pressure lamination |
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