METHOD OF MANUFACTURING SHADOW MASK
A method of perforating through pores by etching in the manufacture of a shadow mask (1). This perforating method comprises the steps of selectively covering both surfaces of a thin metal plate (1) with etching resistant film (4, 5) except a predetermined opening region (2, 3); performing an etching...
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| creator | OHTAKE, YASUHISA KUDOU, MAKOTO SENGOKU, YASUSHI |
| description | A method of perforating through pores by etching in the manufacture of a shadow mask (1). This perforating method comprises the steps of selectively covering both surfaces of a thin metal plate (1) with etching resistant film (4, 5) except a predetermined opening region (2, 3); performing an etching to form recesses (8) on the pore region (2, 3) of one surface of the metal plate (1); covering the one surface of the metal plate with an etching resistance material (6); etching the opening region (3) of the other surface of the metal plate (1) until the bottom of the etching resistance material (6) buried in the recesses of the one surface of the metal plate (1) is exposed; exposing both surfaces of the metal place (1) including the through holes by removing the etching resistant film (4) and the etching resistant material (6); and etching the exposed surfaces of the metal plate (1) again by contacting the exposed surface with an etchant. |
| format | Patent |
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This perforating method comprises the steps of selectively covering both surfaces of a thin metal plate (1) with etching resistant film (4, 5) except a predetermined opening region (2, 3); performing an etching to form recesses (8) on the pore region (2, 3) of one surface of the metal plate (1); covering the one surface of the metal plate with an etching resistance material (6); etching the opening region (3) of the other surface of the metal plate (1) until the bottom of the etching resistance material (6) buried in the recesses of the one surface of the metal plate (1) is exposed; exposing both surfaces of the metal place (1) including the through holes by removing the etching resistant film (4) and the etching resistant material (6); and etching the exposed surfaces of the metal plate (1) again by contacting the exposed surface with an etchant.</description><edition>4</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19881019&DB=EPODOC&CC=EP&NR=0173966B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76292</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19881019&DB=EPODOC&CC=EP&NR=0173966B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OHTAKE, YASUHISA</creatorcontrib><creatorcontrib>KUDOU, MAKOTO</creatorcontrib><creatorcontrib>SENGOKU, YASUSHI</creatorcontrib><title>METHOD OF MANUFACTURING SHADOW MASK</title><description>A method of perforating through pores by etching in the manufacture of a shadow mask (1). This perforating method comprises the steps of selectively covering both surfaces of a thin metal plate (1) with etching resistant film (4, 5) except a predetermined opening region (2, 3); performing an etching to form recesses (8) on the pore region (2, 3) of one surface of the metal plate (1); covering the one surface of the metal plate with an etching resistance material (6); etching the opening region (3) of the other surface of the metal plate (1) until the bottom of the etching resistance material (6) buried in the recesses of the one surface of the metal plate (1) is exposed; exposing both surfaces of the metal place (1) including the through holes by removing the etching resistant film (4) and the etching resistant material (6); and etching the exposed surfaces of the metal plate (1) again by contacting the exposed surface with an etchant.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1988</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD2dQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1cI9nB08Q8HCgZ78zCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAA0NzY0szMydDYyKUAAATCSJQ</recordid><startdate>19881019</startdate><enddate>19881019</enddate><creator>OHTAKE, YASUHISA</creator><creator>KUDOU, MAKOTO</creator><creator>SENGOKU, YASUSHI</creator><scope>EVB</scope></search><sort><creationdate>19881019</creationdate><title>METHOD OF MANUFACTURING SHADOW MASK</title><author>OHTAKE, YASUHISA ; KUDOU, MAKOTO ; SENGOKU, YASUSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0173966B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1988</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><toplevel>online_resources</toplevel><creatorcontrib>OHTAKE, YASUHISA</creatorcontrib><creatorcontrib>KUDOU, MAKOTO</creatorcontrib><creatorcontrib>SENGOKU, YASUSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OHTAKE, YASUHISA</au><au>KUDOU, MAKOTO</au><au>SENGOKU, YASUSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MANUFACTURING SHADOW MASK</title><date>1988-10-19</date><risdate>1988</risdate><abstract>A method of perforating through pores by etching in the manufacture of a shadow mask (1). This perforating method comprises the steps of selectively covering both surfaces of a thin metal plate (1) with etching resistant film (4, 5) except a predetermined opening region (2, 3); performing an etching to form recesses (8) on the pore region (2, 3) of one surface of the metal plate (1); covering the one surface of the metal plate with an etching resistance material (6); etching the opening region (3) of the other surface of the metal plate (1) until the bottom of the etching resistance material (6) buried in the recesses of the one surface of the metal plate (1) is exposed; exposing both surfaces of the metal place (1) including the through holes by removing the etching resistant film (4) and the etching resistant material (6); and etching the exposed surfaces of the metal plate (1) again by contacting the exposed surface with an etchant.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE |
| title | METHOD OF MANUFACTURING SHADOW MASK |
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