SUBSTRATE FOR PRINTED CIRCUITS

In a printed circuit substrate of metal-silicate laminated composite material, the silicate is a BaO-Al2O3-SiO2 glass-ceramic, pref. of compsn. (by wt.) 25-40 (esp. 35)% BaO, 5-20 (esp. 10)% Al2O3 and 40-65 (esp. 55)% SiO2.

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Hauptverfasser: KERSTING, ROLAND, TAITL, INO, REYNOLDS, QUENTIN, DECKELMANN, KARL, HORNUNG, JUERGEN, JONES, GRAHAM STEWART
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creator KERSTING, ROLAND
TAITL, INO
REYNOLDS, QUENTIN
DECKELMANN, KARL
HORNUNG, JUERGEN
JONES, GRAHAM STEWART
description In a printed circuit substrate of metal-silicate laminated composite material, the silicate is a BaO-Al2O3-SiO2 glass-ceramic, pref. of compsn. (by wt.) 25-40 (esp. 35)% BaO, 5-20 (esp. 10)% Al2O3 and 40-65 (esp. 55)% SiO2.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP0170767B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP0170767B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP0170767B13</originalsourceid><addsrcrecordid>eNrjZJALDnUKDglyDHFVcPMPUggI8vQLcXVRcPYMcg71DAnmYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEGhuYG5mbmTobGRCgBAIdUISc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE FOR PRINTED CIRCUITS</title><source>esp@cenet</source><creator>KERSTING, ROLAND ; TAITL, INO ; REYNOLDS, QUENTIN ; DECKELMANN, KARL ; HORNUNG, JUERGEN ; JONES, GRAHAM STEWART</creator><creatorcontrib>KERSTING, ROLAND ; TAITL, INO ; REYNOLDS, QUENTIN ; DECKELMANN, KARL ; HORNUNG, JUERGEN ; JONES, GRAHAM STEWART</creatorcontrib><description>In a printed circuit substrate of metal-silicate laminated composite material, the silicate is a BaO-Al2O3-SiO2 glass-ceramic, pref. of compsn. (by wt.) 25-40 (esp. 35)% BaO, 5-20 (esp. 10)% Al2O3 and 40-65 (esp. 55)% SiO2.</description><language>eng ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS ; GLASS ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MINERAL OR SLAG WOOL ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19910904&amp;DB=EPODOC&amp;CC=EP&amp;NR=0170767B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19910904&amp;DB=EPODOC&amp;CC=EP&amp;NR=0170767B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KERSTING, ROLAND</creatorcontrib><creatorcontrib>TAITL, INO</creatorcontrib><creatorcontrib>REYNOLDS, QUENTIN</creatorcontrib><creatorcontrib>DECKELMANN, KARL</creatorcontrib><creatorcontrib>HORNUNG, JUERGEN</creatorcontrib><creatorcontrib>JONES, GRAHAM STEWART</creatorcontrib><title>SUBSTRATE FOR PRINTED CIRCUITS</title><description>In a printed circuit substrate of metal-silicate laminated composite material, the silicate is a BaO-Al2O3-SiO2 glass-ceramic, pref. of compsn. (by wt.) 25-40 (esp. 35)% BaO, 5-20 (esp. 10)% Al2O3 and 40-65 (esp. 55)% SiO2.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS</subject><subject>GLASS</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1991</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALDnUKDglyDHFVcPMPUggI8vQLcXVRcPYMcg71DAnmYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEGhuYG5mbmTobGRCgBAIdUISc</recordid><startdate>19910904</startdate><enddate>19910904</enddate><creator>KERSTING, ROLAND</creator><creator>TAITL, INO</creator><creator>REYNOLDS, QUENTIN</creator><creator>DECKELMANN, KARL</creator><creator>HORNUNG, JUERGEN</creator><creator>JONES, GRAHAM STEWART</creator><scope>EVB</scope></search><sort><creationdate>19910904</creationdate><title>SUBSTRATE FOR PRINTED CIRCUITS</title><author>KERSTING, ROLAND ; TAITL, INO ; REYNOLDS, QUENTIN ; DECKELMANN, KARL ; HORNUNG, JUERGEN ; JONES, GRAHAM STEWART</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0170767B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>1991</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS</topic><topic>GLASS</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><toplevel>online_resources</toplevel><creatorcontrib>KERSTING, ROLAND</creatorcontrib><creatorcontrib>TAITL, INO</creatorcontrib><creatorcontrib>REYNOLDS, QUENTIN</creatorcontrib><creatorcontrib>DECKELMANN, KARL</creatorcontrib><creatorcontrib>HORNUNG, JUERGEN</creatorcontrib><creatorcontrib>JONES, GRAHAM STEWART</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KERSTING, ROLAND</au><au>TAITL, INO</au><au>REYNOLDS, QUENTIN</au><au>DECKELMANN, KARL</au><au>HORNUNG, JUERGEN</au><au>JONES, GRAHAM STEWART</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE FOR PRINTED CIRCUITS</title><date>1991-09-04</date><risdate>1991</risdate><abstract>In a printed circuit substrate of metal-silicate laminated composite material, the silicate is a BaO-Al2O3-SiO2 glass-ceramic, pref. of compsn. (by wt.) 25-40 (esp. 35)% BaO, 5-20 (esp. 10)% Al2O3 and 40-65 (esp. 55)% SiO2.</abstract><oa>free_for_read</oa></addata></record>
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language eng ; ger
recordid cdi_epo_espacenet_EP0170767B1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
GLASS
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
JOINING GLASS TO GLASS OR OTHER MATERIALS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MINERAL OR SLAG WOOL
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
title SUBSTRATE FOR PRINTED CIRCUITS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T12%3A26%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KERSTING,%20ROLAND&rft.date=1991-09-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP0170767B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true