ELEMENTS AND DEVICES FOR ASSEMBLY OF ELECTRONIC COMPONENTS
A chip carrier mounting device includes a retaining member having a predefined pattern of apertures in which are positioned preforms of joint-forming matenal such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which i...
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| creator | DIAZ, STEPHEN H ALLEN, LESLIE JOHN CHERIAN, GABE |
| description | A chip carrier mounting device includes a retaining member having a predefined pattern of apertures in which are positioned preforms of joint-forming matenal such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. The joint-forming material may be filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer. |
| format | Patent |
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The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. The joint-forming material may be filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.</description><edition>4</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880810&DB=EPODOC&CC=EP&NR=0133752A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880810&DB=EPODOC&CC=EP&NR=0133752A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DIAZ, STEPHEN H</creatorcontrib><creatorcontrib>ALLEN, LESLIE JOHN</creatorcontrib><creatorcontrib>CHERIAN, GABE</creatorcontrib><title>ELEMENTS AND DEVICES FOR ASSEMBLY OF ELECTRONIC COMPONENTS</title><description>A chip carrier mounting device includes a retaining member having a predefined pattern of apertures in which are positioned preforms of joint-forming matenal such as solder. 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The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. The joint-forming material may be filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | ELEMENTS AND DEVICES FOR ASSEMBLY OF ELECTRONIC COMPONENTS |
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