Dielectric glass for multilayered circuits, and thick-film circuits using it
Dielektrisches Glas und die daraus erhaltene Glaskeramik zum Trennen sich kreuzender Leiter in Mehrschichtdickfilmschaltungen mit einer Zusammensetzung in Mol % zwischen den Grenzen: ZnO 10-25; PbO 7, 5-25, SiO2 50-60 und Al2O3 7,5-12,5. Diese Zusammensetzungen eignen sich insbesondere für Leitermus...
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| creator | JOORMANN, HENDRIK JACOBUS MARIA VAN GORP, ALOIS JOZEF MARIA |
| description | Dielektrisches Glas und die daraus erhaltene Glaskeramik zum Trennen sich kreuzender Leiter in Mehrschichtdickfilmschaltungen mit einer Zusammensetzung in Mol % zwischen den Grenzen: ZnO 10-25; PbO 7, 5-25, SiO2 50-60 und Al2O3 7,5-12,5. Diese Zusammensetzungen eignen sich insbesondere für Leitermuster auf Basis von Silber, weil sie ohne Mikroporen sind.
A dielectric glass and a glass ceramic obtained therefrom is provided for separating crossing conductors in multilayer thick-film circuits. The dielectric glass has a composition in mol. % between the limits of 10-25% ZnO, 7.5-25% PbO, 50-60% SiO2, and 7.5-12.5% Al2O3. These compositions are particularly suitable for conductor patterns having silver because they are free from micropores. |
| format | Patent |
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A dielectric glass and a glass ceramic obtained therefrom is provided for separating crossing conductors in multilayer thick-film circuits. The dielectric glass has a composition in mol. % between the limits of 10-25% ZnO, 7.5-25% PbO, 50-60% SiO2, and 7.5-12.5% Al2O3. These compositions are particularly suitable for conductor patterns having silver because they are free from micropores.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MINERAL OR SLAG WOOL ; PRINTED CIRCUITS ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS</subject><creationdate>1984</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19841114&DB=EPODOC&CC=EP&NR=0124943A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19841114&DB=EPODOC&CC=EP&NR=0124943A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JOORMANN, HENDRIK JACOBUS MARIA</creatorcontrib><creatorcontrib>VAN GORP, ALOIS JOZEF MARIA</creatorcontrib><title>Dielectric glass for multilayered circuits, and thick-film circuits using it</title><description>Dielektrisches Glas und die daraus erhaltene Glaskeramik zum Trennen sich kreuzender Leiter in Mehrschichtdickfilmschaltungen mit einer Zusammensetzung in Mol % zwischen den Grenzen: ZnO 10-25; PbO 7, 5-25, SiO2 50-60 und Al2O3 7,5-12,5. Diese Zusammensetzungen eignen sich insbesondere für Leitermuster auf Basis von Silber, weil sie ohne Mikroporen sind.
A dielectric glass and a glass ceramic obtained therefrom is provided for separating crossing conductors in multilayer thick-film circuits. The dielectric glass has a composition in mol. % between the limits of 10-25% ZnO, 7.5-25% PbO, 50-60% SiO2, and 7.5-12.5% Al2O3. These compositions are particularly suitable for conductor patterns having silver because they are free from micropores.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GLASS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PRINTED CIRCUITS</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1984</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBxyUzNSU0uKcpMVkjPSSwuVkjLL1LILc0pycxJrEwtSk1RSM4sSi7NLCnWUUjMS1EoychMztZNy8zJhUsolBZn5qUrZJbwMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ41wADQyMTSxNjR0NjIpQAADuPNWk</recordid><startdate>19841114</startdate><enddate>19841114</enddate><creator>JOORMANN, HENDRIK JACOBUS MARIA</creator><creator>VAN GORP, ALOIS JOZEF MARIA</creator><scope>EVB</scope></search><sort><creationdate>19841114</creationdate><title>Dielectric glass for multilayered circuits, and thick-film circuits using it</title><author>JOORMANN, HENDRIK JACOBUS MARIA ; VAN GORP, ALOIS JOZEF MARIA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0124943A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1984</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GLASS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PRINTED CIRCUITS</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><toplevel>online_resources</toplevel><creatorcontrib>JOORMANN, HENDRIK JACOBUS MARIA</creatorcontrib><creatorcontrib>VAN GORP, ALOIS JOZEF MARIA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JOORMANN, HENDRIK JACOBUS MARIA</au><au>VAN GORP, ALOIS JOZEF MARIA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Dielectric glass for multilayered circuits, and thick-film circuits using it</title><date>1984-11-14</date><risdate>1984</risdate><abstract>Dielektrisches Glas und die daraus erhaltene Glaskeramik zum Trennen sich kreuzender Leiter in Mehrschichtdickfilmschaltungen mit einer Zusammensetzung in Mol % zwischen den Grenzen: ZnO 10-25; PbO 7, 5-25, SiO2 50-60 und Al2O3 7,5-12,5. Diese Zusammensetzungen eignen sich insbesondere für Leitermuster auf Basis von Silber, weil sie ohne Mikroporen sind.
A dielectric glass and a glass ceramic obtained therefrom is provided for separating crossing conductors in multilayer thick-film circuits. The dielectric glass has a composition in mol. % between the limits of 10-25% ZnO, 7.5-25% PbO, 50-60% SiO2, and 7.5-12.5% Al2O3. These compositions are particularly suitable for conductor patterns having silver because they are free from micropores.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL PRINTED CIRCUITS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS |
| title | Dielectric glass for multilayered circuits, and thick-film circuits using it |
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