Chip carrier for large scale integrated circuits and a method for the fabrication of the carrier

A carrier for LSI (Large Scale Integration) chips includes a built-in capacitor structure in the carrier. The capacitor is located beneath the chip (11) with the plates (26, 46, 33) of the capacitor parallel to the chip mounting surface (9) or at right angles to the chip mounting surface. The capaci...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHANCE, DUDLEY AUGUSTUS, KOPCSAY, GERARD VINCENT
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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