FLUXLESS SOLDERING PROCESS
A method of fluxlessly joining members e.g. solder pads, having relatively low melting materials is described. The members to be joined are exposed in a non-oxydising atmosphere to ion beam radiation of sufficient intensify and for a time sufficiently long to cause cleaning of the low melting materi...
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| creator | GREBE, KURT RUDOLPH HARPER, JAMES MCKELL EDWIN |
| description | A method of fluxlessly joining members e.g. solder pads, having relatively low melting materials is described. The members to be joined are exposed in a non-oxydising atmosphere to ion beam radiation of sufficient intensify and for a time sufficiently long to cause cleaning of the low melting materials by removal of contaminating surface oxide layers. The members are then placed into juxtaposition with each other and are heated for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members. The members may be heated conventionally or may be exposed again to an ion beam radiation to effect joining. In a second example, contacting members are cleaned and reflowed in a single step by exposure to an ion beam radiation. In the Figure an ion beam 28 impinges on solder pads 32 on a chip 30 and on matching solder pads 38 on a substrate 36. After cleaning the pads the chip 30 is flipped on to the substrate 36, (indicated by the arrow), and further heated, e.g. by further radiation, to effect joining by solder reflow. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP0069189B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP0069189B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP0069189B13</originalsourceid><addsrcrecordid>eNrjZJBy8wmN8HENDlYI9vdxcQ3y9HNXCAjydwaK8DCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAAwMzS0MLSydDYyKUAAAP6CAp</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FLUXLESS SOLDERING PROCESS</title><source>esp@cenet</source><creator>GREBE, KURT RUDOLPH ; HARPER, JAMES MCKELL EDWIN</creator><creatorcontrib>GREBE, KURT RUDOLPH ; HARPER, JAMES MCKELL EDWIN</creatorcontrib><description>A method of fluxlessly joining members e.g. solder pads, having relatively low melting materials is described. The members to be joined are exposed in a non-oxydising atmosphere to ion beam radiation of sufficient intensify and for a time sufficiently long to cause cleaning of the low melting materials by removal of contaminating surface oxide layers. The members are then placed into juxtaposition with each other and are heated for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members. The members may be heated conventionally or may be exposed again to an ion beam radiation to effect joining. In a second example, contacting members are cleaned and reflowed in a single step by exposure to an ion beam radiation. In the Figure an ion beam 28 impinges on solder pads 32 on a chip 30 and on matching solder pads 38 on a substrate 36. After cleaning the pads the chip 30 is flipped on to the substrate 36, (indicated by the arrow), and further heated, e.g. by further radiation, to effect joining by solder reflow.</description><edition>4</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1985</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850821&DB=EPODOC&CC=EP&NR=0069189B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850821&DB=EPODOC&CC=EP&NR=0069189B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GREBE, KURT RUDOLPH</creatorcontrib><creatorcontrib>HARPER, JAMES MCKELL EDWIN</creatorcontrib><title>FLUXLESS SOLDERING PROCESS</title><description>A method of fluxlessly joining members e.g. solder pads, having relatively low melting materials is described. The members to be joined are exposed in a non-oxydising atmosphere to ion beam radiation of sufficient intensify and for a time sufficiently long to cause cleaning of the low melting materials by removal of contaminating surface oxide layers. The members are then placed into juxtaposition with each other and are heated for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members. The members may be heated conventionally or may be exposed again to an ion beam radiation to effect joining. In a second example, contacting members are cleaned and reflowed in a single step by exposure to an ion beam radiation. In the Figure an ion beam 28 impinges on solder pads 32 on a chip 30 and on matching solder pads 38 on a substrate 36. After cleaning the pads the chip 30 is flipped on to the substrate 36, (indicated by the arrow), and further heated, e.g. by further radiation, to effect joining by solder reflow.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1985</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBy8wmN8HENDlYI9vdxcQ3y9HNXCAjydwaK8DCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAAwMzS0MLSydDYyKUAAAP6CAp</recordid><startdate>19850821</startdate><enddate>19850821</enddate><creator>GREBE, KURT RUDOLPH</creator><creator>HARPER, JAMES MCKELL EDWIN</creator><scope>EVB</scope></search><sort><creationdate>19850821</creationdate><title>FLUXLESS SOLDERING PROCESS</title><author>GREBE, KURT RUDOLPH ; HARPER, JAMES MCKELL EDWIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0069189B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1985</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>GREBE, KURT RUDOLPH</creatorcontrib><creatorcontrib>HARPER, JAMES MCKELL EDWIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GREBE, KURT RUDOLPH</au><au>HARPER, JAMES MCKELL EDWIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLUXLESS SOLDERING PROCESS</title><date>1985-08-21</date><risdate>1985</risdate><abstract>A method of fluxlessly joining members e.g. solder pads, having relatively low melting materials is described. The members to be joined are exposed in a non-oxydising atmosphere to ion beam radiation of sufficient intensify and for a time sufficiently long to cause cleaning of the low melting materials by removal of contaminating surface oxide layers. The members are then placed into juxtaposition with each other and are heated for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members. The members may be heated conventionally or may be exposed again to an ion beam radiation to effect joining. In a second example, contacting members are cleaned and reflowed in a single step by exposure to an ion beam radiation. In the Figure an ion beam 28 impinges on solder pads 32 on a chip 30 and on matching solder pads 38 on a substrate 36. After cleaning the pads the chip 30 is flipped on to the substrate 36, (indicated by the arrow), and further heated, e.g. by further radiation, to effect joining by solder reflow.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | FLUXLESS SOLDERING PROCESS |
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