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A busbar arrangement for making electrical contact with a semiconductor module includes at least two busbars overlapping in an overlap region and electrically insulated from one another. Each busbar includes a web having a connection element, with the webs of the busbars being arranged without an ov...

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Bibliographische Detailangaben

Hauptverfasser:	BÖHMER, Jürgen, Krafft, Eberhard Ulrich, WEIGEL, Jan, NAGEL, Andreas, Kleffel, Rüdiger
Format:	Patent
Sprache:	dan
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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