Plade med indlejret komponent og fremgangsmåde til fremstilling af samme og pakke med plade med indlejret komponent

A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/ in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal...

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Bibliographische Detailangaben

Hauptverfasser:	ITOI, Kazuhisa, OKAMOTO, Masahiro
Format:	Patent
Sprache:	dan
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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