METODE TIL HERMETISK FORSEJLING AF ET AKTIVT LAG OG TILSVARENDE FOTOVOLTAISK INDRETNING

Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

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Hauptverfasser: KHADILKAR, Chandrashekhar, S, MALONEY, John, J, BLONSKI, Robert, P, SRIDHARAN, Srinivasan
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creator KHADILKAR, Chandrashekhar, S
MALONEY, John, J
BLONSKI, Robert, P
SRIDHARAN, Srinivasan
description Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_DK2596527TT3</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>DK2596527TT3</sourcerecordid><originalsourceid>FETCH-epo_espacenet_DK2596527TT33</originalsourceid><addsrcrecordid>eNrjZAj3dQ3xd3FVCPH0UfBwDQLyPIO9Fdz8g4JdvXw8_dwVHN0UXEMUHL1DPMNCFHwc3RX83UGKg8Mcg1z9gBrd_EP8w_x9QhxB-jz9XIJcQ_yA-ngYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyLt5GppZmpkXlIiLExMWoA0rIxkQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METODE TIL HERMETISK FORSEJLING AF ET AKTIVT LAG OG TILSVARENDE FOTOVOLTAISK INDRETNING</title><source>esp@cenet</source><creator>KHADILKAR, Chandrashekhar, S ; MALONEY, John, J ; BLONSKI, Robert, P ; SRIDHARAN, Srinivasan</creator><creatorcontrib>KHADILKAR, Chandrashekhar, S ; MALONEY, John, J ; BLONSKI, Robert, P ; SRIDHARAN, Srinivasan</creatorcontrib><description>Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.</description><language>dan</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; MINERAL OR SLAG WOOL ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190812&amp;DB=EPODOC&amp;CC=DK&amp;NR=2596527T3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190812&amp;DB=EPODOC&amp;CC=DK&amp;NR=2596527T3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KHADILKAR, Chandrashekhar, S</creatorcontrib><creatorcontrib>MALONEY, John, J</creatorcontrib><creatorcontrib>BLONSKI, Robert, P</creatorcontrib><creatorcontrib>SRIDHARAN, Srinivasan</creatorcontrib><title>METODE TIL HERMETISK FORSEJLING AF ET AKTIVT LAG OG TILSVARENDE FOTOVOLTAISK INDRETNING</title><description>Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GLASS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAj3dQ3xd3FVCPH0UfBwDQLyPIO9Fdz8g4JdvXw8_dwVHN0UXEMUHL1DPMNCFHwc3RX83UGKg8Mcg1z9gBrd_EP8w_x9QhxB-jz9XIJcQ_yA-ngYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyLt5GppZmpkXlIiLExMWoA0rIxkQ</recordid><startdate>20190812</startdate><enddate>20190812</enddate><creator>KHADILKAR, Chandrashekhar, S</creator><creator>MALONEY, John, J</creator><creator>BLONSKI, Robert, P</creator><creator>SRIDHARAN, Srinivasan</creator><scope>EVB</scope></search><sort><creationdate>20190812</creationdate><title>METODE TIL HERMETISK FORSEJLING AF ET AKTIVT LAG OG TILSVARENDE FOTOVOLTAISK INDRETNING</title><author>KHADILKAR, Chandrashekhar, S ; MALONEY, John, J ; BLONSKI, Robert, P ; SRIDHARAN, Srinivasan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DK2596527TT33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>dan</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GLASS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KHADILKAR, Chandrashekhar, S</creatorcontrib><creatorcontrib>MALONEY, John, J</creatorcontrib><creatorcontrib>BLONSKI, Robert, P</creatorcontrib><creatorcontrib>SRIDHARAN, Srinivasan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KHADILKAR, Chandrashekhar, S</au><au>MALONEY, John, J</au><au>BLONSKI, Robert, P</au><au>SRIDHARAN, Srinivasan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METODE TIL HERMETISK FORSEJLING AF ET AKTIVT LAG OG TILSVARENDE FOTOVOLTAISK INDRETNING</title><date>2019-08-12</date><risdate>2019</risdate><abstract>Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
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language dan
recordid cdi_epo_espacenet_DK2596527TT3
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GLASS
JOINING GLASS TO GLASS OR OTHER MATERIALS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
MINERAL OR SLAG WOOL
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title METODE TIL HERMETISK FORSEJLING AF ET AKTIVT LAG OG TILSVARENDE FOTOVOLTAISK INDRETNING
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