Effekthalvledermodul i trykkontaktudformning samt fremgangsmåde til dets fremstilling

Effekthalvledermodul i trykkontaktudformning samt fremgangsmåde til dets fremstilling

The module has two substrates (12), which include semiconductor components (20), where the substrates are arranged at a lower side of an assembly base plate (22). The assembly base plate has recesses (26), which are provided for holding contact bases (28), which are in pressure contact with conducti...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: STEGER, JUERGEN, EBERSBERGER, FRANK
Format: Patent
Sprache:dan
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator STEGER, JUERGEN
EBERSBERGER, FRANK
description The module has two substrates (12), which include semiconductor components (20), where the substrates are arranged at a lower side of an assembly base plate (22). The assembly base plate has recesses (26), which are provided for holding contact bases (28), which are in pressure contact with conductive strips of the substrates. A cover (48) is connected with the assembly base plate using a snap catch connection. Two elastic cushion elements (42) are restrained between a cover and band sections (30) of load connection elements. An independent claim is also included for a method for manufacturing the semiconductor module.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_DK1978557TT3</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>DK1978557TT3</sourcerecordid><originalsourceid>FETCH-epo_espacenet_DK1978557TT33</originalsourceid><addsrcrecordid>eNqNiksKwjAQQLtxIeodxgO4kFKqa60IboPbMphJDPmVzFTwQJ7Ei1nEA7h6vMebV9fOGPJyx_AIpKnErMcADqQ8vc9J0MuoTS4xuWSBMQqYQtFishzfL00gLoAm4W_nycJ0LquZwcC0-nFRrU-dOpw3NOSeeMAbJZL-eNnu213TtErV9T_PB0suPEw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Effekthalvledermodul i trykkontaktudformning samt fremgangsmåde til dets fremstilling</title><source>esp@cenet</source><creator>STEGER, JUERGEN ; EBERSBERGER, FRANK</creator><creatorcontrib>STEGER, JUERGEN ; EBERSBERGER, FRANK</creatorcontrib><description>The module has two substrates (12), which include semiconductor components (20), where the substrates are arranged at a lower side of an assembly base plate (22). The assembly base plate has recesses (26), which are provided for holding contact bases (28), which are in pressure contact with conductive strips of the substrates. A cover (48) is connected with the assembly base plate using a snap catch connection. Two elastic cushion elements (42) are restrained between a cover and band sections (30) of load connection elements. An independent claim is also included for a method for manufacturing the semiconductor module.</description><language>dan</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110912&amp;DB=EPODOC&amp;CC=DK&amp;NR=1978557T3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110912&amp;DB=EPODOC&amp;CC=DK&amp;NR=1978557T3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>STEGER, JUERGEN</creatorcontrib><creatorcontrib>EBERSBERGER, FRANK</creatorcontrib><title>Effekthalvledermodul i trykkontaktudformning samt fremgangsmåde til dets fremstilling</title><description>The module has two substrates (12), which include semiconductor components (20), where the substrates are arranged at a lower side of an assembly base plate (22). The assembly base plate has recesses (26), which are provided for holding contact bases (28), which are in pressure contact with conductive strips of the substrates. A cover (48) is connected with the assembly base plate using a snap catch connection. Two elastic cushion elements (42) are restrained between a cover and band sections (30) of load connection elements. An independent claim is also included for a method for manufacturing the semiconductor module.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNiksKwjAQQLtxIeodxgO4kFKqa60IboPbMphJDPmVzFTwQJ7Ei1nEA7h6vMebV9fOGPJyx_AIpKnErMcADqQ8vc9J0MuoTS4xuWSBMQqYQtFishzfL00gLoAm4W_nycJ0LquZwcC0-nFRrU-dOpw3NOSeeMAbJZL-eNnu213TtErV9T_PB0suPEw</recordid><startdate>20110912</startdate><enddate>20110912</enddate><creator>STEGER, JUERGEN</creator><creator>EBERSBERGER, FRANK</creator><scope>EVB</scope></search><sort><creationdate>20110912</creationdate><title>Effekthalvledermodul i trykkontaktudformning samt fremgangsmåde til dets fremstilling</title><author>STEGER, JUERGEN ; EBERSBERGER, FRANK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DK1978557TT33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>dan</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>STEGER, JUERGEN</creatorcontrib><creatorcontrib>EBERSBERGER, FRANK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>STEGER, JUERGEN</au><au>EBERSBERGER, FRANK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Effekthalvledermodul i trykkontaktudformning samt fremgangsmåde til dets fremstilling</title><date>2011-09-12</date><risdate>2011</risdate><abstract>The module has two substrates (12), which include semiconductor components (20), where the substrates are arranged at a lower side of an assembly base plate (22). The assembly base plate has recesses (26), which are provided for holding contact bases (28), which are in pressure contact with conductive strips of the substrates. A cover (48) is connected with the assembly base plate using a snap catch connection. Two elastic cushion elements (42) are restrained between a cover and band sections (30) of load connection elements. An independent claim is also included for a method for manufacturing the semiconductor module.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language dan
recordid cdi_epo_espacenet_DK1978557TT3
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Effekthalvledermodul i trykkontaktudformning samt fremgangsmåde til dets fremstilling
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T03%3A36%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=STEGER,%20JUERGEN&rft.date=2011-09-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EDK1978557TT3%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true