Højtemperatur slipfilm
Multilayered films produced by coextruding or laminating films comprised of at least one layer of polymethylpentene, at least one layer of a polyamide and an intermediate polymeric adhesive layer. The polyamide layer allows the polymethylpentene layer to be stretched up to 6 times its original lengt...
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| creator | DEANTONIS, FERDINAND, A TSAI, MINGLIANG, LAWRENCE DEGRASSI, ALFIERI |
| description | Multilayered films produced by coextruding or laminating films comprised of at least one layer of polymethylpentene, at least one layer of a polyamide and an intermediate polymeric adhesive layer. The polyamide layer allows the polymethylpentene layer to be stretched up to 6 times its original length. Such a high orientation ratio for the mulitlayered film increases the mechanical strength and toughness properties of the film. The mulitlayered films are suitable for use as release films for high temperature composite applications such as printed circuit boards. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_DK0963290TT3</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>DK0963290TT3</sourcerecordid><originalsourceid>FETCH-epo_espacenet_DK0963290TT33</originalsourceid><addsrcrecordid>eNrjZBD3OLwjqyQ1tyC1KLGktEihOCezIC0zJ5eHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsS7eBtYmhkbWRqEhBgbE6MGAESWI14</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Højtemperatur slipfilm</title><source>esp@cenet</source><creator>DEANTONIS, FERDINAND, A ; TSAI, MINGLIANG, LAWRENCE ; DEGRASSI, ALFIERI</creator><creatorcontrib>DEANTONIS, FERDINAND, A ; TSAI, MINGLIANG, LAWRENCE ; DEGRASSI, ALFIERI</creatorcontrib><description>Multilayered films produced by coextruding or laminating films comprised of at least one layer of polymethylpentene, at least one layer of a polyamide and an intermediate polymeric adhesive layer. The polyamide layer allows the polymethylpentene layer to be stretched up to 6 times its original length. Such a high orientation ratio for the mulitlayered film increases the mechanical strength and toughness properties of the film. The mulitlayered films are suitable for use as release films for high temperature composite applications such as printed circuit boards.</description><edition>6</edition><language>dan</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021111&DB=EPODOC&CC=DK&NR=0963290T3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021111&DB=EPODOC&CC=DK&NR=0963290T3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DEANTONIS, FERDINAND, A</creatorcontrib><creatorcontrib>TSAI, MINGLIANG, LAWRENCE</creatorcontrib><creatorcontrib>DEGRASSI, ALFIERI</creatorcontrib><title>Højtemperatur slipfilm</title><description>Multilayered films produced by coextruding or laminating films comprised of at least one layer of polymethylpentene, at least one layer of a polyamide and an intermediate polymeric adhesive layer. The polyamide layer allows the polymethylpentene layer to be stretched up to 6 times its original length. Such a high orientation ratio for the mulitlayered film increases the mechanical strength and toughness properties of the film. The mulitlayered films are suitable for use as release films for high temperature composite applications such as printed circuit boards.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD3OLwjqyQ1tyC1KLGktEihOCezIC0zJ5eHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsS7eBtYmhkbWRqEhBgbE6MGAESWI14</recordid><startdate>20021111</startdate><enddate>20021111</enddate><creator>DEANTONIS, FERDINAND, A</creator><creator>TSAI, MINGLIANG, LAWRENCE</creator><creator>DEGRASSI, ALFIERI</creator><scope>EVB</scope></search><sort><creationdate>20021111</creationdate><title>Højtemperatur slipfilm</title><author>DEANTONIS, FERDINAND, A ; TSAI, MINGLIANG, LAWRENCE ; DEGRASSI, ALFIERI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DK0963290TT33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>dan</language><creationdate>2002</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>DEANTONIS, FERDINAND, A</creatorcontrib><creatorcontrib>TSAI, MINGLIANG, LAWRENCE</creatorcontrib><creatorcontrib>DEGRASSI, ALFIERI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DEANTONIS, FERDINAND, A</au><au>TSAI, MINGLIANG, LAWRENCE</au><au>DEGRASSI, ALFIERI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Højtemperatur slipfilm</title><date>2002-11-11</date><risdate>2002</risdate><abstract>Multilayered films produced by coextruding or laminating films comprised of at least one layer of polymethylpentene, at least one layer of a polyamide and an intermediate polymeric adhesive layer. The polyamide layer allows the polymethylpentene layer to be stretched up to 6 times its original length. Such a high orientation ratio for the mulitlayered film increases the mechanical strength and toughness properties of the film. The mulitlayered films are suitable for use as release films for high temperature composite applications such as printed circuit boards.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | Højtemperatur slipfilm |
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