Apparat til slibning af en halvlederskive

This invention relates to an apparatus for grinding a semiconductor wafer (W) which includes a table (2) having a work stage (10) on which a semiconductor wafer to be ground is placed, at least the work stage being rotated, and a grinding wheel (3) which is moved in a direction perpendicular to or p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GOTOH, NOBORU, NISHIGUCHI, MASANORI
Format:	Patent
Sprache:	dan
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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