Packung für elektronische Schaltung

An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chips packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMANAKA, HISAYOSHI, AKIYAMA, MASATSUGU, OKISHIMA, TETSUYA, IHARA, HIROKAZU, KANEKAWA, NOBUYASU, KAWABATA, KIYOSHI
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE PHYSICS SEMICONDUCTOR DEVICES STATIC STORES
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