Packung für elektronische Schaltung

An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chips packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring b...

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Hauptverfasser: YAMANAKA, HISAYOSHI, AKIYAMA, MASATSUGU, OKISHIMA, TETSUYA, IHARA, HIROKAZU, KANEKAWA, NOBUYASU, KAWABATA, KIYOSHI
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creator YAMANAKA, HISAYOSHI
AKIYAMA, MASATSUGU
OKISHIMA, TETSUYA
IHARA, HIROKAZU
KANEKAWA, NOBUYASU
KAWABATA, KIYOSHI
description An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chips packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring bonding between wire bonding pads formed on the semiconductor chips and the wiring substrate. The wiring substrate may be a multilayer. The bus line includes two data bus lines, the semiconductor chips connected with one data bus line are formed on one side of the wiring substrate and the semiconductor chips connected with the other data bus line are formed on the other side of the wiring substrate.
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subjects BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
title Packung für elektronische Schaltung
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