Flexible Zwischenschaltungsstruktur hoher Dichte
A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate (14) containing the chips (20) interconnected thereby. During fabrication, the flexible portion (39) of the high density interconnect structure is supported by a...
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| creator | EICHELBERGER, CHARLES WILLIAM WOJNAROWSKI, ROBERT JOHN KORNRUMPF, WILLIAM PAUL |
| description | A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate (14) containing the chips (20) interconnected thereby. During fabrication, the flexible portion (39) of the high density interconnect structure is supported by a temporary interconnect support to facilitate fabrication of the structure in accordance with existing fabrication techniques. Subsequently, that temporary support structure may be removed or may remain in place if it is sufficiently flexible to impart the desired degree of flexibility to that portion of the high density interconnect structure. Methods of fabrication are also disclosed. |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Flexible Zwischenschaltungsstruktur hoher Dichte |
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