Verfahren und Anordnung zur Verbesserung der elektrischen Kontakte eines Federsteckverbinders
A method and arrangement for improving electrical contact between a printed circuit board and an electrical component, wherein the electrical components have one or more spring contacts to provide electrical connection to one or more pads on the printed circuit board. The contacting point between a...
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| creator | HAKUNTI, JUSSI KAKELA, MARKO HALKOSAARI, HEIKKI |
| description | A method and arrangement for improving electrical contact between a printed circuit board and an electrical component, wherein the electrical components have one or more spring contacts to provide electrical connection to one or more pads on the printed circuit board. The contacting point between a spring contact may be oxidized due to humidity, condensation water, chlorides or other environment agents. The oxidation at the contact point degrades the electrical connection and, eventually, causes a total loss in electrical contact. A vibration mechanism is used to cause the electrical components to move relative to the printed circuit board and the spring contacts to rub against the pads. The vibrating motion on the spring contacts cleans the contact points of undesirable materials at the contact points. |
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The contacting point between a spring contact may be oxidized due to humidity, condensation water, chlorides or other environment agents. The oxidation at the contact point degrades the electrical connection and, eventually, causes a total loss in electrical contact. A vibration mechanism is used to cause the electrical components to move relative to the printed circuit board and the spring contacts to rub against the pads. 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The contacting point between a spring contact may be oxidized due to humidity, condensation water, chlorides or other environment agents. The oxidation at the contact point degrades the electrical connection and, eventually, causes a total loss in electrical contact. A vibration mechanism is used to cause the electrical components to move relative to the printed circuit board and the spring contacts to rub against the pads. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER CURRENT COLLECTORS DYNAMO-ELECTRIC MACHINES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Verfahren und Anordnung zur Verbesserung der elektrischen Kontakte eines Federsteckverbinders |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T00%3A12%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HAKUNTI,%20JUSSI&rft.date=2007-02-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EDE60207123TT2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |