Power converter module
A power converter module (1) is specified which consists of at least one power semiconductor module (2) and a cooling body (5). The cooling body (5) is flowed through by a coolant liquid (8) and has a flow cavity (9) for this purpose. In order for heat exchange from the power semiconductor module (2...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | LAMBILLY, HERVE DE., NEUCHATEL, CH ETTER, PETER, OBEREHRENDINGEN, CH STEINRUCK, FERDINAND, MOSEN, CH |
description | A power converter module (1) is specified which consists of at least one power semiconductor module (2) and a cooling body (5). The cooling body (5) is flowed through by a coolant liquid (8) and has a flow cavity (9) for this purpose. In order for heat exchange from the power semiconductor module (2) to the coolant liquid to take place as efficiently as possible, coolant fluid washes directly against the underside (7) of the power semiconductor module (2). The underside of the power semiconductor module thus hermetically seals the flow cavity. An intermediate surface is no longer required. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_DE4327895A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>DE4327895A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_DE4327895A13</originalsourceid><addsrcrecordid>eNrjZBALyC9PLVJIzs8rSy0qAbJy81NKc1J5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8i6uJsZG5haWpo6ExEUoAbrghRA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Power converter module</title><source>esp@cenet</source><creator>LAMBILLY, HERVE DE., NEUCHATEL, CH ; ETTER, PETER, OBEREHRENDINGEN, CH ; STEINRUCK, FERDINAND, MOSEN, CH</creator><creatorcontrib>LAMBILLY, HERVE DE., NEUCHATEL, CH ; ETTER, PETER, OBEREHRENDINGEN, CH ; STEINRUCK, FERDINAND, MOSEN, CH</creatorcontrib><description>A power converter module (1) is specified which consists of at least one power semiconductor module (2) and a cooling body (5). The cooling body (5) is flowed through by a coolant liquid (8) and has a flow cavity (9) for this purpose. In order for heat exchange from the power semiconductor module (2) to the coolant liquid to take place as efficiently as possible, coolant fluid washes directly against the underside (7) of the power semiconductor module (2). The underside of the power semiconductor module thus hermetically seals the flow cavity. An intermediate surface is no longer required.</description><edition>6</edition><language>eng ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950223&DB=EPODOC&CC=DE&NR=4327895A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950223&DB=EPODOC&CC=DE&NR=4327895A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LAMBILLY, HERVE DE., NEUCHATEL, CH</creatorcontrib><creatorcontrib>ETTER, PETER, OBEREHRENDINGEN, CH</creatorcontrib><creatorcontrib>STEINRUCK, FERDINAND, MOSEN, CH</creatorcontrib><title>Power converter module</title><description>A power converter module (1) is specified which consists of at least one power semiconductor module (2) and a cooling body (5). The cooling body (5) is flowed through by a coolant liquid (8) and has a flow cavity (9) for this purpose. In order for heat exchange from the power semiconductor module (2) to the coolant liquid to take place as efficiently as possible, coolant fluid washes directly against the underside (7) of the power semiconductor module (2). The underside of the power semiconductor module thus hermetically seals the flow cavity. An intermediate surface is no longer required.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBALyC9PLVJIzs8rSy0qAbJy81NKc1J5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8i6uJsZG5haWpo6ExEUoAbrghRA</recordid><startdate>19950223</startdate><enddate>19950223</enddate><creator>LAMBILLY, HERVE DE., NEUCHATEL, CH</creator><creator>ETTER, PETER, OBEREHRENDINGEN, CH</creator><creator>STEINRUCK, FERDINAND, MOSEN, CH</creator><scope>EVB</scope></search><sort><creationdate>19950223</creationdate><title>Power converter module</title><author>LAMBILLY, HERVE DE., NEUCHATEL, CH ; ETTER, PETER, OBEREHRENDINGEN, CH ; STEINRUCK, FERDINAND, MOSEN, CH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE4327895A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>1995</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LAMBILLY, HERVE DE., NEUCHATEL, CH</creatorcontrib><creatorcontrib>ETTER, PETER, OBEREHRENDINGEN, CH</creatorcontrib><creatorcontrib>STEINRUCK, FERDINAND, MOSEN, CH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LAMBILLY, HERVE DE., NEUCHATEL, CH</au><au>ETTER, PETER, OBEREHRENDINGEN, CH</au><au>STEINRUCK, FERDINAND, MOSEN, CH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Power converter module</title><date>1995-02-23</date><risdate>1995</risdate><abstract>A power converter module (1) is specified which consists of at least one power semiconductor module (2) and a cooling body (5). The cooling body (5) is flowed through by a coolant liquid (8) and has a flow cavity (9) for this purpose. In order for heat exchange from the power semiconductor module (2) to the coolant liquid to take place as efficiently as possible, coolant fluid washes directly against the underside (7) of the power semiconductor module (2). The underside of the power semiconductor module thus hermetically seals the flow cavity. An intermediate surface is no longer required.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng ; ger |
recordid | cdi_epo_espacenet_DE4327895A1 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Power converter module |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T04%3A21%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LAMBILLY,%20HERVE%20DE.,%20NEUCHATEL,%20CH&rft.date=1995-02-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EDE4327895A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |