Rigid polymer laminate with smooth outer surface for stamping - useful as printed circuit board substrate with glass fibre filled core of thermoplastic aryl ether¨ sulphone¨ polymer
Laminate has a smooth outer surface contg. thermoplastic polymer (I) free from fibrous or particulate filler and another layer of filler (I), produced separately. The filler (II) comprises mineral filler(s) and/or glass fibres; and (I) has high enough thermal and chemical stability to fix electrical...
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| creator | CUPTA, GLENN WALTER, ROSWELL, GA., US JACK, GREGORY SCOTT, ROSWELL, GA., US HARTSING JUN., TYLER FRANK, MARIETTA, GA., US |
| description | Laminate has a smooth outer surface contg. thermoplastic polymer (I) free from fibrous or particulate filler and another layer of filler (I), produced separately. The filler (II) comprises mineral filler(s) and/or glass fibres; and (I) has high enough thermal and chemical stability to fix electrical components firmly to the laminate. Pref. (I) is an amorphous polymer with recurring aryl ether sulphone untis of formula -Phe-SO2-Phe-O-Ar-O- (IA) in layer (a) and opt. (b) or with aromatic ether imide units of formula (IB) in layer (a): Phe = p-phenylene; Ar = (i) -Phe-SO2-Phe- or (ii) -Phe-SO2-Phe- and -Phe- in ca. 3:2 - 19:1 molar ratio; or -Phe-Phe-; the bonds of the -O-Z-O- gp. are in the 3,3'-, 3,4'-, 4,3'- and 4,4'- position; Z = -Phe-Phe or pref. -Phe-Cme2-Phe-; R = -Phe-, m-phenylene, -Phe-O-Phe-and/or -Phe-SO2-Phe, pref. m-phenylene. Layer (a) contains ca. 1-10 (wt.)% catalyst (III) for electroless metallisation; or the material is a 3-ply laminate with the configuration (a)-(b)-(a) and layer (b) contains ca. 1-10% (III). (III) pref. is Pd on alumina. USE/ADVANTAGE - Used for printing circuits by the semiadditive, subtractive or esp. additive technique. Produced by laminating extruded layers. (15pp Dwg.No.0/0) |
| format | Patent |
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The filler (II) comprises mineral filler(s) and/or glass fibres; and (I) has high enough thermal and chemical stability to fix electrical components firmly to the laminate. Pref. (I) is an amorphous polymer with recurring aryl ether sulphone untis of formula -Phe-SO2-Phe-O-Ar-O- (IA) in layer (a) and opt. (b) or with aromatic ether imide units of formula (IB) in layer (a): Phe = p-phenylene; Ar = (i) -Phe-SO2-Phe- or (ii) -Phe-SO2-Phe- and -Phe- in ca. 3:2 - 19:1 molar ratio; or -Phe-Phe-; the bonds of the -O-Z-O- gp. are in the 3,3'-, 3,4'-, 4,3'- and 4,4'- position; Z = -Phe-Phe or pref. -Phe-Cme2-Phe-; R = -Phe-, m-phenylene, -Phe-O-Phe-and/or -Phe-SO2-Phe, pref. m-phenylene. Layer (a) contains ca. 1-10 (wt.)% catalyst (III) for electroless metallisation; or the material is a 3-ply laminate with the configuration (a)-(b)-(a) and layer (b) contains ca. 1-10% (III). (III) pref. is Pd on alumina. USE/ADVANTAGE - Used for printing circuits by the semiadditive, subtractive or esp. additive technique. Produced by laminating extruded layers. 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The filler (II) comprises mineral filler(s) and/or glass fibres; and (I) has high enough thermal and chemical stability to fix electrical components firmly to the laminate. Pref. (I) is an amorphous polymer with recurring aryl ether sulphone untis of formula -Phe-SO2-Phe-O-Ar-O- (IA) in layer (a) and opt. (b) or with aromatic ether imide units of formula (IB) in layer (a): Phe = p-phenylene; Ar = (i) -Phe-SO2-Phe- or (ii) -Phe-SO2-Phe- and -Phe- in ca. 3:2 - 19:1 molar ratio; or -Phe-Phe-; the bonds of the -O-Z-O- gp. are in the 3,3'-, 3,4'-, 4,3'- and 4,4'- position; Z = -Phe-Phe or pref. -Phe-Cme2-Phe-; R = -Phe-, m-phenylene, -Phe-O-Phe-and/or -Phe-SO2-Phe, pref. m-phenylene. Layer (a) contains ca. 1-10 (wt.)% catalyst (III) for electroless metallisation; or the material is a 3-ply laminate with the configuration (a)-(b)-(a) and layer (b) contains ca. 1-10% (III). (III) pref. is Pd on alumina. USE/ADVANTAGE - Used for printing circuits by the semiadditive, subtractive or esp. additive technique. Produced by laminating extruded layers. (15pp Dwg.No.0/0)</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjjFqA0EMRbdJEZLcQRdwsXYIpAyOQ-rg3szuanYFM6NB0hB8I9_AvU9mGUzqVP-h__X5j935h2aaoHI6ZhRIIVMJhvBLtoBmZhdu5pY2iWFEiOxsIVcqM6ygKcaWIChUoWI4wUgyNjIYOMjkb4Oa_FXOKahCpEG8iVK65dmZI9iCkrl6wGiEIMcEeLtdTl6S6sIFHe9Ln7uHGJLiy12fOvja7bffK6x8QK2-tKAdPnev_Wbdv71_9Jt_RK5Mr1-E</recordid><startdate>19920402</startdate><enddate>19920402</enddate><creator>CUPTA, GLENN WALTER, ROSWELL, GA., US</creator><creator>JACK, GREGORY SCOTT, ROSWELL, GA., US</creator><creator>HARTSING JUN., TYLER FRANK, MARIETTA, GA., US</creator><scope>EVB</scope></search><sort><creationdate>19920402</creationdate><title>Rigid polymer laminate with smooth outer surface for stamping - useful as printed circuit board substrate with glass fibre filled core of thermoplastic aryl ether¨ sulphone¨ polymer</title><author>CUPTA, GLENN WALTER, ROSWELL, GA., US ; JACK, GREGORY SCOTT, ROSWELL, GA., US ; HARTSING JUN., TYLER FRANK, MARIETTA, GA., US</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE4132169A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>1992</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>CUPTA, GLENN WALTER, ROSWELL, GA., US</creatorcontrib><creatorcontrib>JACK, GREGORY SCOTT, ROSWELL, GA., US</creatorcontrib><creatorcontrib>HARTSING JUN., TYLER FRANK, MARIETTA, GA., US</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CUPTA, GLENN WALTER, ROSWELL, GA., US</au><au>JACK, GREGORY SCOTT, ROSWELL, GA., US</au><au>HARTSING JUN., TYLER FRANK, MARIETTA, GA., US</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Rigid polymer laminate with smooth outer surface for stamping - useful as printed circuit board substrate with glass fibre filled core of thermoplastic aryl ether¨ sulphone¨ polymer</title><date>1992-04-02</date><risdate>1992</risdate><abstract>Laminate has a smooth outer surface contg. thermoplastic polymer (I) free from fibrous or particulate filler and another layer of filler (I), produced separately. The filler (II) comprises mineral filler(s) and/or glass fibres; and (I) has high enough thermal and chemical stability to fix electrical components firmly to the laminate. Pref. (I) is an amorphous polymer with recurring aryl ether sulphone untis of formula -Phe-SO2-Phe-O-Ar-O- (IA) in layer (a) and opt. (b) or with aromatic ether imide units of formula (IB) in layer (a): Phe = p-phenylene; Ar = (i) -Phe-SO2-Phe- or (ii) -Phe-SO2-Phe- and -Phe- in ca. 3:2 - 19:1 molar ratio; or -Phe-Phe-; the bonds of the -O-Z-O- gp. are in the 3,3'-, 3,4'-, 4,3'- and 4,4'- position; Z = -Phe-Phe or pref. -Phe-Cme2-Phe-; R = -Phe-, m-phenylene, -Phe-O-Phe-and/or -Phe-SO2-Phe, pref. m-phenylene. Layer (a) contains ca. 1-10 (wt.)% catalyst (III) for electroless metallisation; or the material is a 3-ply laminate with the configuration (a)-(b)-(a) and layer (b) contains ca. 1-10% (III). (III) pref. is Pd on alumina. USE/ADVANTAGE - Used for printing circuits by the semiadditive, subtractive or esp. additive technique. Produced by laminating extruded layers. (15pp Dwg.No.0/0)</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | Rigid polymer laminate with smooth outer surface for stamping - useful as printed circuit board substrate with glass fibre filled core of thermoplastic aryl ether¨ sulphone¨ polymer |
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