Kühlungsanordnung mit hohem Wärmewirkungsgrad und hoher Umgebungssicherheit

A heat sink is disclosed for cooling a module having a plurality of chip sites thereon. The heat sink includes a frame member (10) which is made of a material having a coefficient of thermal expansion which is substantially that of the substrate to which it is bonded. The frame has a plurality of fi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARNOLD, ALLEN JOSEPH, LA GRANGEVILLE N.Y. 12540, US, SUTTON, KERRY LOUIS, WAPPINGERS FALLS N.Y. 12590, US, MIS, KATHERINE HEINZ, POURGHKEEPSIE N.Y. 12603, US, COURTNEY, MARK GERARD, POURGHKEEPSIE N.Y. 12601, US, KIRBY, DIANE NEIL, POURGHKEEPSIE N.Y. 12601, US
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!