Method and device for the electrostatic coating of electrical printed circuit boards

The invention relates to a method for the electrostatic coating of electrical printed circuit boards having through-holes as a soldering point for connecting leads. This method is characterised by the fact that the printed circuit boards which are transported continuously in the suspended position a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KORSTEN,GUENTER, GRAH,KLAUS, SCHAUF,WERNER
Format: Patent
Sprache:eng ; ger
Schlagworte:
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