Method and device for the electrostatic coating of electrical printed circuit boards

The invention relates to a method for the electrostatic coating of electrical printed circuit boards having through-holes as a soldering point for connecting leads. This method is characterised by the fact that the printed circuit boards which are transported continuously in the suspended position a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KORSTEN,GUENTER, GRAH,KLAUS, SCHAUF,WERNER
Format: Patent
Sprache:eng ; ger
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Beschreibung
Zusammenfassung:The invention relates to a method for the electrostatic coating of electrical printed circuit boards having through-holes as a soldering point for connecting leads. This method is characterised by the fact that the printed circuit boards which are transported continuously in the suspended position are coated on one side, then turned, coated on the other side, and both coating layers are then immediately dried at the same time. The invention furthermore also comprises a device for electrostatic coating of electrical printed circuit boards.