Semiconductor arrangement

Known compact semiconductor arrangements, so-called modules, comprising at least two semiconductor components in a common insulating package mounted on a base plate and electrically connected require high manufacturing costs and, for the purpose of connection to further modules, appreciable assembly costs. The novel semiconductor arrangement should yield an appreciable reduction in the cost required for assembly in a pre-determined configuration and for electrical circuitry using thermally separated individual components which can be produced in a mechanised way. The semiconductor arrangement comprises at least two semiconductor components and a collector contact component which is common to all the semiconductor components, said components being connected to form an assembly. The semiconductor components are disposed on, and mechanically mounted on the collector contact component and electrically connected via said collector contact component. All the components in the assembly are so designed that the connecting leads of one assembly component are interconnected with features of the other for the purpose of the connection envisaged. The collector contact component is a conductor composite structure encapsulated in insulating material and having current connection points and semiconductor component connection points. The semiconductor arrangement is used in power electronics.