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Applying a protective covering to a substrate involves first heating it to not more than 80 (pref., 60) deg.C, then (A) applying a curable polymeric compsn., (D) which is liq., at 20 deg. C, is curable within 24 (pref., 6) hrs., at not more than 80 (pref., 60) deg. C, and contains (i) a resin (pref....

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Bibliographische Detailangaben
Hauptverfasser:	RINDE, JAMES ARTHUR, FREMONT, CALIFORNIA 94539, US, PIESLAK, GEORGE, MENLO PARK, CALIFORNIA 94025, US, VAN ZELE, ERIC, B-1338 LASNE, BE, JOHN, ROBIN, B-1900 OVERIJSE, KESSEL-LO, BE, ALVERNAZ, TONY G., MODESTO, CA 95356, US
Format:	Patent
Sprache:	ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BLASTING CHEMISTRY COMPOSITIONS BASED THEREON ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS GENERAL PROCESSES OF COMPOUNDING HEATING JOINTS OR FITTINGS FOR PIPES LIGHTING MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PIPES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THEIR PREPARATION OR CHEMICAL WORKING-UP THERMAL INSULATION IN GENERAL TRANSPORTING WEAPONS WORKING-UP
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Beschreibung
Zusammenfassung:	Applying a protective covering to a substrate involves first heating it to not more than 80 (pref., 60) deg.C, then (A) applying a curable polymeric compsn., (D) which is liq., at 20 deg. C, is curable within 24 (pref., 6) hrs., at not more than 80 (pref., 60) deg. C, and contains (i) a resin (pref., thermosetting) pref., Bisphenol A epoxy, a polyamide and a tert., amine, (ii) a curing agent, (iii) opt., a Bronsted base, 0.01-2 mol in excess of amt., to effect cure, (iv) 0.1-10 wt.% of a silane, (v) less than 5 wt.% of a solvent (pref., none). (B) Applying one or more polymeric layers, the innermost (E) of which being capable of interacting with (D). (C) Allowing (D) to cure while maintaining (E) in contact. In the absence of (iii) (D) is cured at a temp., at which the outermost layer does not melt, and if a single is applied it is shaped.