Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier

Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier

According to this method for three-dimensional expansion of the electrically conductive connections between the connecting contacts (2) of large-scale integrated electronic components, especially of semiconductor circuits which are arranged especially in flat-pack housings (1), and the contact point...

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1. Verfasser: KAMMERER,GERD
Format: Patent
Sprache:eng ; ger
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BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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creator KAMMERER,GERD
description According to this method for three-dimensional expansion of the electrically conductive connections between the connecting contacts (2) of large-scale integrated electronic components, especially of semiconductor circuits which are arranged especially in flat-pack housings (1), and the contact points of an electrical connecting device on a component carrier (5), the connecting contacts (2) are arranged in a three-dimensional manner on the housing (1) or are aligned with respect to a connecting device on a component carrier (5) in such a manner that the connecting points of the individual connecting contacts (2) to the contacts of the connecting device are arranged in a distributed manner on the component and/or on the component carrier (5) on at least two contact point planes which run one above the other.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_DE3430849A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>DE3430849A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_DE3430849A13</originalsourceid><addsrcrecordid>eNqNjrFuwkAMhrN0qGjfwS8QCZQM7Vi1IBY2duTe_QknBft0ZwGPzGNwSYO6dOhg2T5__s7P1W0HO6qnThPZESUSUPtwguSgwgPhGnmqSbsJwQBnKbgycypSmnH4DbsAMhGPZ-nH0thZHpcHTj3qXBZBQQx9YoOffSrBFfoUVSCFZ_EP1yigqEF-NCx_nVD-8jgHByrH8K-JHKcUkF6qp46HjNc5LyrarPef2xpRD8iRHQR2-Fo3bbN8a98_Vs0_kDtkMHC3</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier</title><source>esp@cenet</source><creator>KAMMERER,GERD</creator><creatorcontrib>KAMMERER,GERD</creatorcontrib><description>According to this method for three-dimensional expansion of the electrically conductive connections between the connecting contacts (2) of large-scale integrated electronic components, especially of semiconductor circuits which are arranged especially in flat-pack housings (1), and the contact points of an electrical connecting device on a component carrier (5), the connecting contacts (2) are arranged in a three-dimensional manner on the housing (1) or are aligned with respect to a connecting device on a component carrier (5) in such a manner that the connecting points of the individual connecting contacts (2) to the contacts of the connecting device are arranged in a distributed manner on the component and/or on the component carrier (5) on at least two contact point planes which run one above the other.</description><edition>4</edition><language>eng ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1986</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19860306&amp;DB=EPODOC&amp;CC=DE&amp;NR=3430849A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19860306&amp;DB=EPODOC&amp;CC=DE&amp;NR=3430849A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAMMERER,GERD</creatorcontrib><title>Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier</title><description>According to this method for three-dimensional expansion of the electrically conductive connections between the connecting contacts (2) of large-scale integrated electronic components, especially of semiconductor circuits which are arranged especially in flat-pack housings (1), and the contact points of an electrical connecting device on a component carrier (5), the connecting contacts (2) are arranged in a three-dimensional manner on the housing (1) or are aligned with respect to a connecting device on a component carrier (5) in such a manner that the connecting points of the individual connecting contacts (2) to the contacts of the connecting device are arranged in a distributed manner on the component and/or on the component carrier (5) on at least two contact point planes which run one above the other.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1986</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjrFuwkAMhrN0qGjfwS8QCZQM7Vi1IBY2duTe_QknBft0ZwGPzGNwSYO6dOhg2T5__s7P1W0HO6qnThPZESUSUPtwguSgwgPhGnmqSbsJwQBnKbgycypSmnH4DbsAMhGPZ-nH0thZHpcHTj3qXBZBQQx9YoOffSrBFfoUVSCFZ_EP1yigqEF-NCx_nVD-8jgHByrH8K-JHKcUkF6qp46HjNc5LyrarPef2xpRD8iRHQR2-Fo3bbN8a98_Vs0_kDtkMHC3</recordid><startdate>19860306</startdate><enddate>19860306</enddate><creator>KAMMERER,GERD</creator><scope>EVB</scope></search><sort><creationdate>19860306</creationdate><title>Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier</title><author>KAMMERER,GERD</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE3430849A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>1986</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAMMERER,GERD</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAMMERER,GERD</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier</title><date>1986-03-06</date><risdate>1986</risdate><abstract>According to this method for three-dimensional expansion of the electrically conductive connections between the connecting contacts (2) of large-scale integrated electronic components, especially of semiconductor circuits which are arranged especially in flat-pack housings (1), and the contact points of an electrical connecting device on a component carrier (5), the connecting contacts (2) are arranged in a three-dimensional manner on the housing (1) or are aligned with respect to a connecting device on a component carrier (5) in such a manner that the connecting points of the individual connecting contacts (2) to the contacts of the connecting device are arranged in a distributed manner on the component and/or on the component carrier (5) on at least two contact point planes which run one above the other.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T00%3A04%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KAMMERER,GERD&rft.date=1986-03-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EDE3430849A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true