DE3211970

This cover board for panel heating systems, in particular floor heating systems, contains in a heat-insulating supporting board (2) a multiplicity of heat-conducting elements (4), which form in it heat bridges leading from one side of the board to the other. The heat-conducting elements (4) consist of a material which has a higher coefficient of thermal conductivity than the material of the supporting board, for example of a magnesium-oxide or aluminium-oxide sintered material. The heat-conducting elements (4) may be fitted as prefabricated parts into the supporting board (2) or produced by pressing a plastic, solidifying heat-conducting cement mass into clearances (2c) in the supporting board (2). There is preferably a heat-insulating air or plastic layer (5) between the heat-conducting elements (4) and the material of the supporting board. With approximately the same constructional properties as a conventional building board corresponding to the supporting board (2), the cover board is a better heat conductor. In the case of a panel heating system, the heating elements (9) are laid in grooves (13) of an underlay base (12) and the grooves (13) are filled with a heat-conducting mass (15). A thermally conducting layer (6b) joins the cover boards (10) to the underlay base (12). Such panel heating systems have a better control response with shorter heating-up and cooling-down times, thereby saving energy.