Electronic hybrid circuit

An electronic hybrid circuit is proposed which has a substrate plate (10) composed of an insulating material, with passive and/or active components connected to one another via conductor tracks (11) in accordance with the circuit structure. Components which act as resistors and connecting areas (11a...

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Bibliographische Detailangaben
Hauptverfasser:	SEIPLER,DIETER,DR, BACHER,BERNHARD
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	An electronic hybrid circuit is proposed which has a substrate plate (10) composed of an insulating material, with passive and/or active components connected to one another via conductor tracks (11) in accordance with the circuit structure. Components which act as resistors and connecting areas (11a) are applied to the substrate plate (10) in thick-film or thin-film technology. For the purpose of connecting the hybrid circuit externally, connecting means (12) are provided which project essentially vertically from the substrate plate (10) and which have a foot (12a) which is wide compared with their length and is soldered to the respective connecting area (11a). The connecting means (12) may be formed as wire heads and provided with a pull relief (13) which is preferably formed as a loop. The connecting means (12) are soldered onto the hybrid circuit, preferably using solder paste (14).