Verfahren zum Herstellen einer monolithischen integrierten Halbleiterschaltung

The method of making a monolithic integrated semiconductor device with vertical and lateral NPN, P-JFET, P-MOS, and D-MOS elements, includes forming these elements on the surface of a monocrystalline P conductive substrate by selectively forming an N + zone. An upper layer of n conductive semiconduc...

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creator CURRAN, PATRICK A., PLANO, TEX., US
description The method of making a monolithic integrated semiconductor device with vertical and lateral NPN, P-JFET, P-MOS, and D-MOS elements, includes forming these elements on the surface of a monocrystalline P conductive substrate by selectively forming an N + zone. An upper layer of n conductive semiconductor material on this zone at each point where a diffusion MOS element or a lateral NPN element is to be formed. Insulating PN transition zones are formed between P + zones, through the epitaxial layer. In the selected zones, a thin doped P-conductive surface is formed and another in the D-MOS regions. Further zones are formed for source and drain zones, and for the collector and emitter contacts. The gate insulators are selectively formed and the concentrating voltage for the P-MOS elements is applied. Boron ions are implanted to form the depletion channels for P-MOS and P-JFET elements and contacts and metallising are added.
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subjects BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
CONTROLLING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
PULSE TECHNIQUE
REGULATING
SEMICONDUCTOR DEVICES
SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
title Verfahren zum Herstellen einer monolithischen integrierten Halbleiterschaltung
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